EZ1000 Datasheet, PDF (1/5 Pages) Marktech Corporate – Gen II LEDs

Cree^® EZ1000™ Gen II LEDs
Data Sheet
CxxxEZ1000-Sxx000-2
Cree’s EZBright™ LEDs are the next generation of solid-state LED emitters that combine highly efficient InGaN
materials with Cree’s proprietary optical design and device submount technology to deliver superior value for high-
intensity LEDs. The optical design maximizes light extraction efficiency and enables a Lambertian radiation pattern.
Additionally, these LEDs are die-attachable with conductive epoxy, solder paste or solder preforms, as well as the flux
eutectic method. These vertically structured, low forward voltage LED chips are approximately 170 microns in height.
Cree’s EZ™ chips are tested for conformity to optical and electrical specifications.These LEDs are useful in a broad
range of applications such as general illumination, automotive lighting, and LCD backlighting.
FEATURES
APPLICATIONS
● EZBright LED Technology
● General Illumination
» 380 mW min. – 450 nm
» 360 mW min. – 460 nm
» 110 mW min. – 527 nm
● Lambertian Radiation
» Aircraft
» Decorative Lighting
» Task Lighting
● Conductive Epoxy, Solder Paste or Preforms, or Flux
» Outdoor Illumination
Eutectic Attach
● Low Forward Voltage
● White LEDs
● Dielectric Passivation across Epi Surface
● LCD Backlighting
● Projection Displays
● Automotive
CxxxEZ1000-Sxx000-2 Chip Diagram
Top View
EZBright LED
980 x 980 μm²
Dielectric
Passivation
Bottom View
150 x 150 μm²
Die Cross Section
t = 170 μm
Cathodes (-)
Gold Bond Pads (2)
Backside Metalization
Subject to change without notice.
www.cree.com
Anode (+)
3 μm AuSn
1