EZ900_15 Datasheet, PDF (1/6 Pages) Marktech Corporate – Gen II LEDs

Cree^® EZ900™ Gen II LEDs
Data Sheet
CxxxEZ900-Sxx000-2
Cree’s EZBright™ LEDs are the next generation of solid-state LED emitters that combine highly efficient InGaN
materials with Cree’s proprietary optical design and device submount technology to deliver superior value for high-
intensity LEDs. The optical design maximizes light extraction efficiency and enables a Lambertian radiation pattern.
Additionally, these LEDs are die-attachable with conductive epoxy, solder paste or solder preforms, as well as the flux
eutectic method. These vertically structured, low forward voltage LED chips are approximately 170 microns in height.
Cree’s EZ™ chips are tested for conformity to optical and electrical specifications.These LEDs are useful in a broad
range of applications such as general illumination, automotive lighting, and LCD backlighting.
FEATURES
APPLICATIONS
● EZBright LED Technology
● General Illumination
» 380 mW min. - 450 & 460 nm
» 340 mW min - 470 nm
● Lambertian Radiation
» Aircraft
» Decorative Lighting
● Conductive Epoxy, Solder Paste or Preforms, or Flux
» Task Lighting
Eutectic Attach
● Low Forward Voltage
● Dielectric Passivation across Epi Surface
» Outdoor Illumination
● White LEDs
● LCD Backlighting
● Projection Displays
● Automotive
CxxxEZ900-Sxx000-2 Chip Diagram
Top View
EZBright LED
880 x 880 μm²
Bottom View
Dielectric
Passivation
Die Cross Section
Cathodes (-)
150 x 150 μm²
t = 170 μm
Gold Bond Pads (2)
Backside Metalization
Subject to change without notice.
www.cree.com
Anode (+)
3 μm AuSn
1