MA03503D_1 Datasheet, PDF (6/6 Pages) Tyco Electronics – Control Chip, Parallel Input Gain/Phase Control 8.0-11.0 GHz

Control Chip, Parallel Input Gain/Phase Control
8.0-11.0 GHz
Assembly and Bonding Diagram
V_GG
0.1 μF
100 pF
100 pF
0.1 μF
V_DD
MA03503D
MA03503D
Rev A
Preliminary Information
RF_IN
RF_OUT
DATA
11
100 pF
0.1 μF
V_EE
Figure 5. Recommended bonding diagram.
Support circuitry typical of MMIC characterization fixture for CW testing.
Assembly Instructions:
Die attach: Use AuSn (80/20) 1-2 mil. preform solder. Limit time @ 300 °C to less than 5 minutes.
Wirebonding: Bond @ 160 °C using standard ball or thermal compression wedge bond techniques. For
DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge bonds of
shortest length, although ball bonds are also acceptable.
Biasing Note: Must apply negative bias to V_GG before applying positive bias to V_DD to prevent
damage to amplifier.
6
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