MA08509D_1 Datasheet, PDF (5/5 Pages) Tyco Electronics – Amplifier, Power, 10W 8.5-10.5 GHz

Amplifier, Power, 10W
8.5—10.5 GHz
Assembly and Bonding Diagram
0.1 μF
0.1 μF
V_DD
V_GG
0.1μF
100 pF
100 pF
100 pF
MA08509D
Rev A
Preliminary Information
RF_IN
RF_OUT
V_GG
0.1μF
100 pF
100 pF
0.1 μF
100 pF
0.1 μF
V_DD
Figure 5. Recommended bonding diagram for pedestal mount.
Support circuitry typical of MMIC characterization fixture for CW testing.
NOTE: Indicated Gate voltage pad (VGG 2) represents the nominal bias
condition. However, the device current can be increased or decreased
as required by bonding to either VGG 1 or VGG 3 (respectively).
Assembly Instructions:
Die attach: Use AuSn (80/20) 1 mil. preform solder. Limit time @ 310 °C to less
than 7 minutes. Refer to Application Note AN3017 for more detailed information.
Wirebonding: Bond @ 160 °C using standard ball or thermal compression wedge
bond techniques. For DC pad connections, use either ball or wedge bonds. For best
RF performance, use wedge bonds of shortest length, although ball bonds are also
acceptable.
Biasing Note: Must apply negative bias to V_GG before applying positive bias to
V_DD to prevent damage to amplifier.
5
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