1-1462051-6 Datasheet, PDF (5/6 Pages) Tyco Electronics – HF3 Relay

RF Signal Relays
HF3 Relay (Continued)
Processing
Recommended soldering conditions
Vapour phase soldering
20 to 40s
240°C
full line: typical
dotted line: process limits
180°C
130°C
external preheating
100°C
forced cooling
Vapour phase soldering
temperature/time profile
(lead and housing peak temp.)
Time [s]
Recommended reflow soldering profile
Infrared soldering
temperature/time profile
(lead and housing peak temp.)
Packing
Reel dimensions
Resistance to soldering heat
Infrared soldering
temperature/time profile
(lead and housing peak temp.)
Time [s]
Time [s]
AXICOM
Tape and reel for SMT
06-2013, Rev. 0613
www.te.com
© 2013 Tyco Electronics Corporation,
a TE Connectivity Ltd. company
Datasheets and product specification
according to IEC 61810-1 and to be used
only together with the ‘Definitions’ section.
5
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tion, application notes and all specifications
the ‘Definitions’ section, available at
are subject to change.
http://relays.te.com/definitions