2-1393774-7 Datasheet, PDF (4/5 Pages) Tyco Electronics – P1 Relay V23026

P1 V23026 Relay
P1 V23026 Relay
Recommended Solderin_Ag _XCo_ICn_Odi_Mtions
SIP_RoC_eld/_cJeEorinD_mgE_{mCcoJne-dnSitTd}ioD_en-s_d02aS0coBcolr_dd_ein_rg_inIE^T_Pg^eC^le_1C^c6^o_V^m_o0^-0_n^,₂5^S_dⁱ8^g₃ⁿ-_iS^a2_t0^l_ii-^a_go5₂ⁿ_n8^d_na6^Ra_ls^Fn_R^R_Rd_e^e_l^la_ae^y_y^s_lsay
Packing
AXICOM
10_A8-9_X80_I0_C9_ORe_Mv. E
AXICOM ^{Telecom-, Signal and RF Relays}
Soldering conditions according IEC 60058-_P2₁-5_R8_ea_lan_yd _{V23026 (Continued)}
IPC/JEDEC J-STD-020B
20 - 40 sec Full line: typical
P1 V23026 Relay ^{Telecom-, Signal and RF Relays}
P1 V23026 Relay
Recomm240e°Cnded Soldering Conditions Dotted line: process limits
Processing
PaPcackkiningg
SIPoCld_R/Jee_cEroinD_mgE_m1eCc28n4o_{0d0Jne°°-C}d_dCSistTi_oo_lDdn_{e-sr0in2ag0ccBco}o_ndr_id_tioi²n_n⁰g_s^{- 4}I⁰E^sC^ec
Full line: typical
60D0o5tte8d-l2in-e5: p8roacenssdlimits
Soldering₁c₃o₀n_°d_Citions according IEC 60058-2-58 and
IPC/JEDEC J-STD-020B
1¹0⁸0⁰°^°C^C
forced
cooling
Packing
Tube for THT version
40 relays per tube, 2000 relays per box
Tube for
40 relays
2‘000 re
130 °C
240 °C
20 - 40 sec
Full line: typical
Dotted line: ^fp^or^ro^cc^ee^dss limits
cooling
100 °C
180 °C
130 °C
100 °C
forced
cooling
Resistance to soldering heat - Re ow pro le
Vapor Phase Soldering: Temperature/Time Profile
(Lead and Housing Peak Temperature)
Vapor Phase Soldering: Temperature/Time Profile
(Lead and Housing Peak Temperature)
Resistance to soldering heat - Re ow pro le
Resistance to soldering heat - Reflow profile
Vapor Phase Soldering:
temperature/time profile (lead
and housing peak temperature)
Resistance to soldering heat - Re ow pro le
Vapor Phase Soldering: Temperature/Time Profile
T⁽a^Lp^ee^aa^dnd^arⁿee^dl fo^Hr^oS^uM^sTⁱⁿve^grs^Pion^{eak Temperature)}
480 relay₁s_1.p_6±e₀r_.2reel, 2400 relays per box
Tape and
480 rela
2‘400 pe
Reel dimension
11.6±0.2
Time (s)
Infrared Soldering: Temperature/Time Profile
(Lead and Housing Peak Temperature)
Time (s)
Recommended re ow soldering pro le
Infrared Soldering: temperature/
time profile (lead and housing
Rec^Ro^ecm^omm^me^en^ndd^ee^dd^refr^loe^w o^sow^ldes^rio^ngld^pe^ror^fi^iln^e g pro
peak temperature)
le
Re^Ieⁿl^fd^raim^ree^dns^Sio^on^{ldering: Tem11p.6±e0r.2ature/Time Profile}
(Lead and Housing Pe¹a^1.6k^±0T^.2emperature)
Reel dimensions
Time (s)
Infrared Soldering: Temperature/Time Profile
R(eLeel daidmeannsdioHn ousing Peak Temperature)
Reel dimension
Recommended re ow soldering pro le
All specifications subject to change. Consult Tyco Electronics for latest specifications.
Time (s)
Time (s)
Infrared Soldering: Temperature/Time Profile
(Lead and Housing Peak Temperature)
All specifications subject to change. Consult Tyco Electronics for latest specifications.
Infrared Soldering: Temperature/Time Profile
(Lead and Housing Peak Temperature)
All specifications subject to change. Consult Tyco Electronics for latest specifications.
Time (s)
Infrared Soldering: Temperature/Time Profile
All s(pLeeciaficdatiaonnsdsuHbjeocut tsoicnhganPgee. CaoknsTuelt mTycpoeErleactturorneic)s for latest specifications.
All specifications subject to change. Consult Tyco Electronics for latest specifications.
9 of 12
All specifications subject to change. Consult Tyco Electronics for latest specifications.
4
02-2012, Rev. 0212
Datasheets and product specification
Datasheets and product data is subject to the
www.te.com
according to IEC 61810-1 and to be used
terms of the disclaimer and all chapters of
© 2011 Tyco Electronics Corporation,
only together with the ‘Definitions’ section.
the ‘Definitions’ section, available at
a TE Connectivity Ltd. company
http://relays.te.com/definitions
All specifications subject to change. Consult Tyco Electronics for latest specifications.
9 of 12
Datasheets, product data, ‘Definitions’ sec-
tion, application notes and all specifications
are subject to change.
9 of 12