MADS-001317-1320AG Datasheet, PDF (3/3 Pages) Tyco Electronics – GaAs Solder Bump Flip Chip Schottky Diode

GaAs Solder Bump Flip Chip Schottky Diode
Device Installation Procedures
The following guidelines should be observed to avoid damaging GaAs Flip-Chips.
MADS-001317-1320AG
V1.00
Cleanliness
These devices should be handled in a clean environment. Do Not attempt to Clean Die After installation.
Static Sensitivity
Gallium arsenide Schottky diodes are ESD sensitive and can be damaged by static electricity. Since Schottky
diodes are rated as Class 0, proper ESD techniques should be used when handling these devices.
General Handling
These devices have a polymer layer which provides scratch protection for the junction area and the anode air
bridge. Die can be handled with plastic tweezers or picked and placed automatically with a #27 tip vacuum
pencil.
Assembly Requirements using Tin Lead Solder
This Flip Chip Diode employs a 6um thick, Sn 63 / Pb 37 Solderable interface as part of the 50µm high solder
bump. These chips are designed to be soldered onto hard or soft substrates with the junction side down. They
should be mounted onto silkscreened circuits using 60/40 Sn/Pb solder paste. A typical profile for a Sn 63/ Pb
37 Soldering process is provided in Application Note, M538 Surface Mounting Instructions on the M/A-COM
website www.macom.com
Typical SPICE PARAMETERS
Is
Rs
N
Ct0
M
Ik
Vj
FC
BV
(A)
(Ω)
( pF )
(A) (V)
(V)
1.7E-14 4.6
1.08
.047
.38
.016
.86
.99
7
IBV
(A)
1.0E-5
Absolute Maximum Ratings @ 25˚C¹
Parameter
Operating Temperature
Storage Temperature
Incident LO Power
Incident RF Power
Mounting Temperature
Maximum Ratings
-65 °C to +125 °C
-65 °C to +150 °C
+ 20 dBm
+ 20 dBm
+300 °C for 10 seconds
Notes
1.Exceeding these limits may cause permanent damage.
Ordering Information
Part Number
MADS-001317-1320AG
Packaging
Gel Pack
Specification Subject to Change Without Notice
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