MADS-001317-1320AG Datasheet, PDF (1/3 Pages) Tyco Electronics – GaAs Solder Bump Flip Chip Schottky Diode

GaAs Solder Bump Flip Chip Schottky Diode
Features
• Low Series Resistance, 4 Ω
• Low Capacitance, 45 fF
• High Cutoff Frequency
• Silicon Nitride Passivation
• Polyimide Scratch Protection
• Solderable Bump Die Attach
MADS-001317-1320AG
V1
Mounting Side with Solder Bumps
Description
M/A-COM's MADS-001317-1320AG is a Gallium Arsenide Flip-Chip Schottky diode with solder bumps.These
devices are fabricated on OMCVD epitaxial wafers using a process designed for high device uniformity and extremely low
parasitics. This device can be used up to 80 GHz. This diode is fully passivated with silicon nitride and has an additional
layer of a polymer for scratch protection. The protective coatings prevent damage to the junction during handling and
circuit attachment.
Applications
The high cutoff frequency of this device allows use through millimeter wave frequencies. Typical applications
include single and double balanced mixers in PCN tranceivers, radios, police radar detectors and automotive radar
detectors
Electrical Specifications T_A = 25 °C
Parameters and Test Conditions
Junction Capacitance at 0V at 1 MHz
Total Capacitance at 0V at 1 MHz¹
Dynamic Resistance at 9.5 mA – 10.5 mA
Reverse Breakdown Voltage at 10uA
Symbol Units MADS-0001317-1320AG
Min Typ. Max
Ct
pF
.020 0.030
Rs
Ω
.030
.045
.060
Vf
Volts
4
7
Vb
Volts
4.5
7
Notes:
1. Total capacitance is equivalent to the sum of junction capacitance Cj and parasitic capacitance Cp.
Specification Subject to Change Without Notice
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