MA4SW410 Datasheet, PDF (3/6 Pages) Tyco Electronics – SP4T Monolithic PIN Diode Switch

SP4T PIN Diode Switch
Assembly Considerations
The following precautions should be observed for successful
assembly of the die.
Cleanliness
These chips should be handled in a clean environment. Do not
attempt to clean die after installation.
Electro-Static Sensitivity
The MA4SW Series PIN switches are ESD, Class 1 sensitive.
The proper ESD handling procedures should be used.
Die Wire Bonding
Thermosonic wedge wire bonding using ¼ x 3 mil sq. ribbon
or Ball Bonding using 1 mil diameter gold wire is
recommended. A stage temperature of 150 ^oC and a force of
18 to 22 grams should be used. Ultrasonic energy should be
adjusted to the minimum required. RF bonds should be as
short as possible.
Die Mounting
These chips have Ti-Pt-Au back metal. They can be die
mounted with a gold-tin eutectic solder preform or conductive
Ag epoxy. Mounting surface must be clean and flat.
MA4SW410
V 1.00
Eutectic Die Attachment
An 80/20 Gold-Tin eutectic solder preform is recommended
with a work surface temperature of 255 ^oC and a tool tip
temperature of 265 ^oC. When hot gas is applied, the tool tip
temperature should be 290 ^oC. The chip should not be exposed
to temperatures greater than 320 ^oC for more than 20 seconds.
No more than three seconds should be required for the attachment.
Electrical Epoxy
Die Attachment
Assembly should be preheated to 125-150 ^oC. A Controlled
thickness of 2 mils is recommended for best electrical and
thermal conductivity. A thin epoxy fillet should be visible
around the perimeter of the chip after placement. Cure epoxy
per manufacturer’s schedule.
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s)
or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
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