MA4AGP907 Datasheet, PDF (3/5 Pages) Tyco Electronics – AlGaAs Flip-Chip PIN Diode

AlGaAs Flip-Chip PIN Diode
Device Installation Procedures
The following guidelines should be observed to
avoid damaging GaAs Flip-Chips.
Cleanliness
These chips should be handled in a clean
environment. Do not attempt to clean die after
installation.
Static Sensitivity
Aluminum Gallium Arsenide PIN diodes are ESD
sensitive and can be damaged by static electricity.
Proper ESD techniques should be used when
handling these devices. These devices are rated
Class 0, ( 0-199V ) per HBM MIL-STD-883, method
3015.7 [C = 100pF ±10%, R = 1.5kW ±1%]. Even
though tested die pass 50V ESD, they must be
handled in a static-free environment.
General Handling
These devices have a polymer layer which provides
scratch protection for the junction area and the
anode air bridge. Die can be handled with plastic
tweezers or picked and placed automatically with a
#27 tip vacuum pencil.
Ordering Information
Part Number
MA4AGP907
MA4AGP907-T
MA4AGP907-W
Package
Die in Carrier
Tape in Reel
Wafer on Frame
MA4AGP907
V1
Assembly Requirements Using
Electrically Conductive Ag Epoxy and
Solder
These chips are designed to be inserted onto hard
or soft substrates with the junction side down. They
should be mounted onto silk-screened circuits using
Electrically Conductive Ag Epoxy, approximately 1-2
mils in thickness and cured at approximately 90°C to
150 °C per manufacturer’s schedule . For extended
cure times > 30 minutes, temperatures must be
below 200 °C.
Sn Rich Solders ( > 30 % Sn by weight ) are not
recommended due to the Tungsten Metallization
scheme beneath the gold contacts. Indalloy type or
80 Au/20 Sn Solders are acceptable. Maximum
soldering temperature must be < 300 °C for < 10 sec.
Circuit Mounting Dimensions (Inches)
0.013
0.012
(2) PL
0.008
(2) PL
3
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