MA4AGBLP912 Datasheet, PDF (3/5 Pages) Tyco Electronics – AlGaAs Beam Lead PIN Diode

AlGaAs Beam Lead PIN Diode
Assembly Considerations
The following precautions should be observed to avoid
damaging these chips.
Cleanliness
These devices should be handled in a clean environment. Do
not attempt to clean die after installation.
Static Sensitivity
Aluminum Gallium Arsenide PIN diodes are Class 1 ESD
sensitive and can be damaged by static electricity. Proper ESD
techniques should be used when handling these devices.
MA4AGBLP912
V 1.00
General Handling
These devices have a polymer layer which provides scratch
protection for the junction area and the anode air bridge. Beam
lead devices must, however, be handled with extreme care
since the leads may easily be distorted or broken by the normal
pressures exerted when handled with tweezers. A vacuum
pencil with a #27 tip is recommended for picking and placing.
These devices were designed to be inserted onto hard or soft
substrates. Recommended methods of attachment include ther-
mocompression bonding, parallel-gap welding, solder reflow,
and electrically conductive silver epoxy.
See Application Note M541, “Bonding and Handling Proce-
dures for Chip Diode Devices” for More Detailed Assembly
Instructions.
Diode Model
Rs
Ls = 0.5 nH
Ct
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s)
or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
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