MA08509D Datasheet, PDF (3/3 Pages) Tyco Electronics – 10W Power Amplifier Die Preliminary Release 8.0-11 GHz

10W Power Amplifier Die (8-11 GHz)
APPLICATION INFORMATION
VGG
VDD
100 pF
VDD
RF IN
50 Ω
RF OUT
50 Ω
VGG
100 pF
VDD ^VDD
MA08509D
Assembly:
Chip dimensions: 4.6 mm x 4.6 mm, .003”
thickness.
Die attach: Use AuSn (80/20) 1-2 mil.
preform solder. Limit time @ 300 °C to less
than 5 minutes.
Wirebonding: Bond @ 160 °C using
standard ball or thermal compression wedge
bond techniques. For DC pad connections,
use either ball or wedge bonds. For best RF
performance, use wedge bonds of shortest
length, although ball bonds are also
acceptable.
Biasing:
1. User must apply negative bias to V_GG before
applying positive bias to V_DD to prevent
damage to amplifier.
Figure 5. Recommended bonding diagram for pedestal
mount. Support circuitry typical of MMIC characterization
fixture for CW testing
Specifications subject to change without notice.
North America: Tel. [phone], Fax [phone]
Asia/Pacific: Tel. [phone], Fax [phone]
Europe: Tel. [phone], Fax [phone]
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902179 D