4-5435166-9 Datasheet, PDF (3/7 Pages) Tyco Electronics – Dual In- Line Package (DIP) Programming Switches

114- 1056
C. Chemical Exposure
Do not store switches near any chemicals listed below, as they may cause stress corrosion cracking in the
components.
Alkalies
Amines
Ammonia
Carbonates
Citrates
Nitrites
Phosphates Citrates
Sulfur Nitrites
Sulfur Compounds
Tartrates
NOTE
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Where the above environmental conditions exist, phosphor- bronze contacts are recommended.
3.4. PC Board
A. Material and Thickness
The pc board material must be glass epoxy (FR--4 or G--10). The pc board thickness shall be 2.36 [.093].
NOTE
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Contact PRODUCT INFORMATION at the number at the bottom of page 1 for suitability of other pc board materials
and thicknesses.
B. Tolerance
Maximum allowable bow of the pc board must be 0.08 [.003] over each 25.4 [1.00] of length.
C. Layout
The solder tail contact holes in the pc board must be precisely located to ensure proper placement and
optimum performance of the switch. The layout dimensions and tolerances shown in Figure 2 must be
observed when preparing pc boards for the various switches. The layout shows the top (component) side
of the board.
Recommended PC Board Layout
2.54+0.13 [.100+.005] Typ
0.89+0.13 [.035+.005] Dia Typ
Note: Not to Scale
7.62+0.13
[.300+.005]
Figure 2
3.5. Holes
The holes in the pc board for the contact solder tails must be drilled and plated through to specific dimensions
given in Figure 3.
3.6. Mounting Requirements
Determine whether the switch will be soldered directly to the pc board (a sealed switch will be required), or
whether the switch is to be installed in a socket (an unsealed switch can be used).
A. DIP Socket
1. Secure DIP socket to pc board according to instructions packaged with socket.
2. Start one row of contact leads into one row of contact cavities in socket, then rotate switch until it is
parallel with socket.
Rev D
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