MRF392 Datasheet, PDF (2/4 Pages) Motorola, Inc – BROADBAND PUSH-PULL RF POWER TRANSISTOR NPN SILICON

ELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise noted)
Characteristic
Symbol
OFF CHARACTERISTICS (1)
Collector–Emitter Breakdown Voltage (IC = 50 mAdc, IB = 0)
Collector–Emitter Breakdown Voltage (IC = 50 mAdc, VBE = 0)
Emitter–Base Breakdown Voltage (IE = 5.0 mAdc, IC = 0)
Collector Cutoff Current (VCB = 30 Vdc, IE = 0)
ON CHARACTERISTICS (1)
V(BR)CEO
V(BR)CES
V(BR)EBO
ICBO
DC Current Gain (IC = 1.0 Adc, VCE = 5.0 Vdc)
hFE
DYNAMIC CHARACTERISTICS (1)
Output Capacitance (VCB = 28 Vdc, IE = 0, f = 1.0 MHz)
Cob
FUNCTIONAL TESTS (2) — See Figure 1
Common–Emitter Amplifier Power Gain
Gpe
(VCC = 28 Vdc, Pout = 125 W, f = 400 MHz)
Collector Efficiency
η
(VCC = 28 Vdc, Pout = 125 W, f = 400 MHz)
Load Mismatch
ψ
(VCC = 28 Vdc, Pout = 125 W, f = 400 MHz,
VSWR = 30:1, all phase angles)
NOTES:
1. Each transistor chip measured separately.
2. Both transistor chips operating in push–pull amplifier.
C11
Min
Typ
Max
Unit
30
—
—
Vdc
60
—
—
Vdc
4.0
—
—
Vdc
—
—
5.0
mAdc
40
60
100
—
—
75
95
pF
8.0
10
—
dB
50
55
—
%
No Degradation in Output Power
C12 ^C13
L5
C14
+
C15
+ 28 V
–
B1
C1
Z1
L1
Z2
Z3
L3
Z4
Z5
B2
C9
Z6
C3
C4
C5
C6
C7
C8
Z1
C2
Z2
Z3
D.U.T.
L2
Z4
Z5
L4
Z6
C10
L6
C16
C17
C18 _C19
C1, C2 — 240 pF, 100 Mil Chip Cap (ATC) or Equivalent
B1 — Balun, 50 Ω Semi–Rigid Coaxial Cable 86 Mil OD, 2″ L
C3 — 3.6 pF, 100 Mil Chip Cap (ATC) or Equivalent
B2 — Balun, 50 Ω Semi–Rigid Coaxial Cable 86 Mil OD, 2″ L
C4, C8 — 8.2 pF, 100 Mil Chip Cap (ATC) or Equivalent
Z1 — Microstrip Line 270 Mil L x 125 Mil W
C5, C6 — 20 pF, 100 Mil Chip Cap (ATC) or Equivalent
Z2 — Microstrip Line 375 Mil L x 125 Mil W
C7 — 18 pF, Mini Unelco or Equivalent
Z3 — Microstrip Line 280 Mil L x 125 Mil W
C9, C10 — 270 pF, 100 Mil Chip Cap (ATC) or Equivalent
Z4 — Microstrip Line 300 Mil L x 125 Mil W
C11, C12, C16, C17 — 470 pF 100 Mil Chip Cap (ATC) or Equivalent _{Z5 — Microstrip Line 350 Mil L x 125 Mil W}
C13, C18 — 680 pF Feedthru
Z6 — Microstrip Line 365 Mil L x 125 Mil W
C14, C19 — 0.1 µF Erie Redcap or Equivalent
C15 — 20 µF, 50 V
Board Material — 0.0625″ Teflon Fiberglass ε_r = 2.5 ± 0.05 1 oz. Cu.
Board Material — CLAD, Double Sided
L1, L2 — 0.15 µH Molded Choke With Ferrite Bead
L3, L4 — 2–1/2 Turns #20 AWG, 0.200 ID
L5, L6 — 3–1/2 Turns #18 AWG, 0.200 ID
Figure 1. 400 MHz Test Fixture
REV 8
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