MA4SPS402 Datasheet, PDF (2/3 Pages) Tyco Electronics – Surface Mount Monolithic PIN Diode Chip

Surface Mount Monolithic PIN Diode Chip
MA4SPS402 SurMount™ Series
Electrical Specifications @ +25°C
Symbol
C_T
C_T
R_S
R_S
R_S
Test Conditions
-40 Volts, 1 MHz ¹
-40 Volts, 1 GHz ^{1, 3}
10 mA, 2 MHz ²
10 mA, 100 MHz ²
10 mA, 1 GHz ^{2, 3}
Units
Min.
pF
pF
Ω
Ω
Ω
V_F
1.0 mA
V_R
10 µA
V
V
-70
I_R
-70V
µA
T_L
10 mA / 6 mA
ns
1. Total capacitance is equivalent to the sum of junction capacitance C_j and parasitic capacitance.
2. Series resistance R_S is equivalent to the total diode series resistance including the junction resistance R_j.
3. R_S and C_P is measured on an HP4291A with die mounted in an ODS-186 package with conductive silver epoxy.
Typ.
0.034
0.041
5.0
4.6
5.0
0.84
-120
200
Max.
0.045
1.00
10
Handling Procedures
All semiconductor chips should be handled with care to avoid
damage or contamination from perspiration and skin oils. The
use of plastic tipped tweezers or vacuum pickups is strongly
recommended for individual components. Bulk handling should
insure that abrasion and mechanical shock are minimized.
ESD
These devices very susceptible to ESD and are rated Class 0
(0-199V) per HBM MIL-STD-883, method 3015.7 [C = 100pF
±10%, R = 1.5kΩ ±1%]. Even though tested die pass 100V
ESD, they must be handled in a static-free environment.
Bonding Techniques
Attachment to a circuit board is made simple through the use of
surface mount technology. Mounting pads are conveniently
located on the bottom surface of these diodes and are removed
from the active junction locations. These diodes are well suited
for solder attachment onto hard and soft substrates. The use of
80/20 Au/Sn and 60/40 Sn/Pb solder is recommended.
Conductive epoxy paste for attachment may also be used, this
can be silk-screened, or used with a conductive sheet apoxy.
When soldering these diodes to a hard substrate, hot gas die
bonding is preferred. We recommend utilizing a vacuum tip and
a force of 60 to 100 grams applied normal to the top surface of
the part. When soldering to soft substrates, it is recommended
to use a lead-tin interface at the circuit board mounting pads.
Position the die so that its mounting pads are aligned with the
circuit board’s mounting pads Reflow the solder by heating the
circuit trace near the mounting pad while applying 60 to 100
grams of force perpendicular to the top surface of the die.
Since the HMIC™ glass is transparent, the edges of the
mounting pads closest to each other can be visually inspected
through the die after attach is completed.
Specifications subject to change without notice.
n North America: Tel. [phone], Fax [phone]
n Asia/Pacific: Tel.[phone], Fax [phone]
n Europe: Tel. [phone], Fax[phone]
Visit www.macom.com for additional data sheets and product information.
Functional Schematic¹
Ls
Cp
Rp
Rvia
-
1. Rs = 2 * Rvia + Rp
Rvia
+
V 2.0
2