MA4FCP305 Datasheet, PDF (2/3 Pages) Tyco Electronics – Silicon Flip Chip PIN Diode

Silicon Flip Chip PIN Diode
Electrical Specifications @ T_A = + 25 °C
Parameters @ Conditions
Total Capacitance @ -10 V, 1 MHz¹
Total Capacitance @ -10 V, 1 GHz^1,3
Series Resistance @ +50 mA^2,3 , 100 MHz
Series Resistance @ +50 mA^2,3 , 1 GHz
Symbol
C_T
C_T
R_S
R_S
Units
pF
pF
Ω
Ω
Forward Voltage @ +100 mA
Reverse Voltage @ -10 µ A
Reverse Current @ -40 V
50 - 90% Lifetime @ +10 mA / -6 mA
Steady State Thermal Resistance⁴
V_F
V
V_R
V
I_R
µA
TL
ns
θ
° C/W
Min.
-40
MA4FCP305
V 3.00
Typ.
0.060
0.050
1.7
2.1
1.05
-50
25
640
Max.
1.25
10
1. Total capacitance is equivalent to the sum of junction capacitance Cj and parasitic capacitance, Cp.
2. Series resistance R_S is equivalent to the total diode series resistance including the junction resistance Rj.
3. Rs and Cp measured on an HP4291A with die mounted in an ODS-186 package.
4. Steady-state thermal resistance measured with die mounted in an ODS-186 package.
Assembly Considerations
The following precautions should be observed for successful
assembly of the die.
Cleanliness
These chips should be handled in a clean environment. Do not
attempt to clean die after installation.
ESD
These devices very susceptible to ESD and are rated Class 0
(0-199 V) per HBM MIL-STD-883, method 3015.7
[C = 100 pF ±10%, R = 1.5k Ω ±1%]. Even though tested die
pass 100 V ESD, they must be handled in a static-free
environment
General Handling
The protective polymer coating on the active areas of these
devices provides scratch protection, particularly for the metal
airbridge that contacts the anode. Die can be handled with
tweezers or vacuum pickups and are suitable for use with
automatic pick-and-place equipment.
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s)
or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
Mounting Techniques
These devices were designed for insertion onto hard or soft
substrates with the junction side down. They can be mounted
with electrically conductive epoxy or with a low temperature
solder preform. The die can also be assembled with the
junction side up, and wire or ribbon bonds made to the pads.
Solder Die Attach Using
Electrically Conductive Ag Epoxy
and Solder
These chips are designed to be inserted onto hard or soft
substrates with the junction side down. They should be
mounted onto silkscreened circuits using Electrically
Conductive Ag Epoxy, approximately 1-2 mils in thickness
and cured at approximately 90 °C to 150 °C per
manufacturer’s schedule . For extended cure times >30
minutes, temperatures must be below 200 °C.
Sn Rich Solders are not recommended due to the Tungsten
Metallization scheme beneath the gold contacts. Indalloy or
80 Au/20 Sn Solders are acceptable. Maximum soldering
temperature must be <300 °C for <10 sec.
2
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