MA4FCP305 Datasheet, PDF (1/3 Pages) Tyco Electronics – Silicon Flip Chip PIN Diode

Silicon Flip Chip
PIN Diode
V 3.00
Features
1269 Outline Drawing
n Low Series Resistance : 1.7 Ω
n Low Capacitance : 50 fF
Top View
A
n Fast Switching Speed : 20 nS
n Silicon Nitride Passivation
n Polyimide Scratch Protection
n Designed for Automated Pick and Place Insertion
F
B
n Rugged by Design
Description
M/A-COM’s MA4FCP Series consists of Silicon Flip Chip PIN
diodes fabricated with M/A-COM’s patented HMIC process. This
diode is fabricated on epitaxial wafers using a process designed for
repeatable electrical characteristics and extremely low parasitics.
This diode is fully passivated with Silicon Nitride and has an
additional layer of Polyimide for scratch protection. These
protective coatings prevent damage to the junction during
automated or manual handling. This flip chip configuration is
suitable for pick and place insertion.
Side View
D
E
Bottom View
D
C
Applications
The small 0315 outline and low 0.085 pS RC product, make the
device useful for multi-throw switch and switched phase shifter
circuits requiring < 20 nS switching speeds up to 18 GHz operating
frequency.
Absolute Maximum Ratings
@ 25 °C¹
Parameter
Forward Current
Reverse Voltage
Operating Temperature
Storage Temperature
Dissipated Power
Mounting Temperature
Value
100 mA
-40 V
-55 °C to +150 °C
-55 °C to +150 °C
230 mW
+300 °C for 10 seconds
Cathode Mark
Nominal Die Dimensions
Inches
Millimeters
Dim
Min
Max
Min
Max
A
0.0269 0.0289 0.683 0.733
B
0.0135 0.0155 0.343 0.393
C
0.0040 0.0080 0.102 0.203
D
0.0041 0.0061 0.105 0.155
E
0.0124 0.0144 0.315 0.365
F
0.0069 0.0089 0.175 0.225
1. Exceeding any of these values may result in permanent
damage