MA4E2099 Datasheet, PDF (2/3 Pages) Tyco Electronics – High Barrier Silicon Schottky Diodes: Bridge Octoquad

High Barrier Silicon Schottky Diodes: Bridge Octoquad
Electrical Specifications @ 25 °C
(Measured at Adjacent Ports: 1-2, 2-3, 3-4, 4-1)
Part
Number
Vf @ 1 mA Vf @ 10 mA
(V)
(V)
Ct @ 0V Vb @10 µA
(pF)
(V )
Min Max Min Max
Typ
Min
MA4E2099-1284 1.08 1.24 1.32 1.52
0.16
9
MA4E2099-1284
V 2.00
Rt Slope Resistance
( Vf1 - Vf2 ) /
(10.5 mA-9.5 mA )
(Ω)
Max
16
Rt is the dynamic slope resistance where Rt = Rs + Rj, where Rj = 26 / Idc (Idc is in mA) and Rs is the Ohmic Resistance.
Handling
All semiconductor chips should be handled with care to avoid
damage or contamination from perspiration and skin oils. The
use of plastic tipped tweezers or vacuum pickups is strongly
recommended for individual components. The top surface of
the die has a protective polyimide coating to minimize damage.
Bulk handling should insure that abrasion and mechanical
shock are minimized.
The rugged construction of these HMIC devices allows the use
of standard handling and die attach techniques. It is important
to note however that industry standard electrostatic discharge
(ESD) control is required at all times, due to the sensitive
nature of Schottky devices having a Class 0 rating.
Die Attach
Die attach for these devices is made through the use of
conventional gold plated die attach technology. A vacuum
collet or plastic tweezers are recommended for device
placement onto the circuit or ground plane. The device
backside metal consists of approximately 0.3 um Ti-Pt-Au.
This metallization scheme allows for die attach to hard and
soft substrates ( for via grounding ) and Au plated metal
ground planes with 80Au/20Sn and Sn63/Pb37 solders. The
maximum time-temperature profile is 300 °C for 5 sec.
Attachment of die to circuit medium with electrically
conductive silver epoxies is also acceptable.
Die Bonding
Wire and ribbon bonding from the topside bond pads to the
circuit can be accomplished with 1 mil dia. gold wire or ¼
x 3 mil sq. gold ribbon. Ball bonding, wedge bonding, or
thermo-compression bonding are all acceptable. The
topside of the die is protected with a durable polymer for
impact and scratch protection.
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s)
or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
2
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