5-104655-6 Datasheet, PDF (2/13 Pages) Tyco Electronics – Fine Pitch SMT Stacking Connectors

Fine Pitch SMT Stacking Connectors
(Parallel Board-to-Board)
PAMagPeM_HOeDaUd 5(C0o/n5t0inuGedr)id Connectors
Product Facts
■ Surface-mount products for
parallel board-to-board
applications, as well as
right angle board-to-board
and cable-to-board
applications
■ High density 1.27 x 1.27
[.050 x .050] centerline grid
■ Three board-to-board stack
heights: 6.35 [.250], 8.13
[.320] and 9.91 [.390]
■ Non-protrusive metallic
holddowns
■ Reliable dual beam
receptacle contacts for
redundant contact
■ Duplex plated receptacle
and post contacts; gold
plated on mating areas,
tin-lead plated on tails
■ Compatible with standard
surface-mount processing
(VPR and IR)
■ Receptacle and header
allow for drainage of
processing fluids
■ Tape and reel packaging
available, contact
Tyco Electronics for details
■ Polarized header and
receptacle assemblies
■ Sizes of 10, 20, 30, 40, 50,
60, 70, 80 and 100 positions
■ Recognized under the
Component Program of
Underwriters
Laboratories Inc., R
File No. E28476
■ Certified by Canadian
Standards
Association
R
File No. LR7189
See Catalog 1307819 for
additional AMPMODU product
offerings.
AMPMODU 50/50 Grid
Vertical Headers and
Receptacles are designed
for parallel board-to-board
stacking in high density
applications.
Right angle board-to-board
and cable-to-board applica-
tions are also possible,
since the vertical recepta-
cles also mate with non-
latching right angle headers
(page 95) and the vertical
headers also mate with non-
latching cable connectors.
Available are dual-row,
vertical shrouded headers
and receptacles in sizes
ranging from 10 through
100 positions (in 10 position
increments).
Parallel board-to-board
stack heights of 6.35 [.250],
8.13 [.320] and 9.91 [.390]
are achievable by selection
of the appropriate header.
The receptacle is the same
for all three stack height
headers.
Non-protrusive metallic
holddowns are designed for
use in 1.57 [.062] or thicker
PC boards and allow sur-
face mounting to both sides
of the board. In addition to
providing retention during
processing, the holddowns
are soldered during reflow
and therefore provide long
term strain relief for the lead
solder joints.
AMPMODU 50/50 Grid
Vertical Headers and
Receptacles are compatible
with standard surface-
mount processes; IR
(infrared) and VPR (vapor
phase reflow). The surface-
mount connectors have
been designed so that
dimensioning, tolerances,
referenced datums, hold-
Non-Protrusive
Metallic Holddowns
down characteristics and
packaging methods result
in a system that is compati-
ble with robotic assembly.
The headers and recepta-
cles feature polarization to
prevent misalignment.
Three Board Stack Heights
6.35 ^{± 0.15}
[.250 ± .006]
8.13 ± 0.15
[.320 ± .006]
9.91 ± 0.15
[.390 ± .006]
Catalog 889092
Revised 9-06
www.tycoelectronics.com
Dimensions are in millimeters
and inches unless otherwise
specified. Values in brackets
are standard equivalents.
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-5-729-0425
89
South America: 55-11-3611-1514
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-141-810-8967