MA4SW510B-1 Datasheet, PDF (7/7 Pages) Tyco Electronics – SP5T PIN Diode Switch with Integrated Bias Network

MA4SW510B-1
HMIC™ Silicon PIN Diode Switch
with Integrated Bias Network
RoHS Compliant
M/A-COM Products
V2
Wire/Ribbon and Die Attachment Recommendations
Cleanliness
These chips should be handled in a clean environment.
Wire Bonding
Thermosonic wedge wire bonding using 0.00025” x 0.003” ribbon or 0.001” diameter gold wire is
recommended. A heat stage temperature of 150^oC and a force of 18 to 22 grams should be used. Ultrasonic
energy should be adjusted to the minimum required to achieve a good bond. RF bond wires should be kept as
short and straight as possible.
Mounting
The HMIC switches have Ti-Pt-Au back metal. They can be die mounted with a gold-tin eutectic solder
preform or conductive epoxy. Mounting surface must be clean and flat.
Eutectic Die Attachment
An 80/20, gold-tin, eutectic solder preform is recommended with a work surface temperature of 255^oC and a
tool tip temperature of 265^oC. When hot gas is applied, the tool tip temperature should be 290^oC. The chip
should not be exposed to temperatures greater than 320^oC for more than 20 seconds. No more than three
seconds should be required for attachment. Solders containing tin should not be used.
Epoxy Die Attachment
A minimum amount of epoxy should be used. A thin epoxy fillet should be visible around the perimeter of the
chip after placement. Cure epoxy per manufacturer’s schedule. (typically 125-150^oC).
Ordering Information
Part Number
MA4SW510B-1
Package
Waffle Pack
7
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