MA4SW510B-1 Datasheet, PDF (6/7 Pages) Tyco Electronics – SP5T PIN Diode Switch with Integrated Bias Network

MA4SW510B-1
HMIC™ Silicon PIN Diode Switch
with Integrated Bias Network
RoHS Compliant
MA4SW510B-1
Chip Outline Drawing^1,2
M/A-COM Products
V2
DIM
A
B
C
D
E
F
G
RF Bond Pads (J1-J6)
DC Bond Pads (B2-B6)
Chip Thickness
Mils
MIN
MAX
54
55
27
28
30
31
31
32
19
20
118.5
120.5
35
36
7 X 5 REF.
5 X 5 REF.
5 REF.
Millimeters
MIN
MAX
1.37
1.40
0.69
0.71
0.76
0.79
0.79
0.81
0.48
0.51
3.01
3.06
0.89
0.91
.178 X .127 REF.
.127 X .127 REF.
0.127 REF.
Notes:
1. Topside and backside metallization is gold , 2.5µM thick typical.
2. Yellow areas indicate wire bonding pads
6
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Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commit- _{MA-COM Technical Solutions and its affiliates reserve the right to make changes to the}
ment to produce in volume is not guaranteed.
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