MA4AGSW1 Datasheet, PDF (7/7 Pages) Tyco Electronics – AlGaAs SPST Reflective PIN Diode Switch

MA4AGSW1
SPST Reflective AlGaAs PIN Diode Switch
Rev. V3
ASSEMBLY INSTRUCTIONS
CLEANLINESS
These chips should be handled in a clean environment.
STATIC SENSITIVITY
These Devices are considered ESD Class 0 HBM. Proper ESD techniques should be used when handling
these devices.
GENERAL HANDLING
The protective polymer coating on the active areas of the die provides scratch and impact protection,
particularly for the metal air bridge, which contacts the diode’s anode. Die should primarily be handled with
vacuum pickups, or alternatively with plastic tweezers.
ASSEMBLY TECHNIQUES
The MA4AGSW1, AlGaAs switch is designed to be mounted with electrically conductive silver epoxy or with a
lower temperature solder perform, which does not have a rich tin content.
SOLDER DIE ATTACH
All die attach and bonding methods should be compatible with gold metal. Solder which does not scavenge
gold, such as 80/20, Au/Sn or Indalloy #2 is recommended. Do not expose die to temperatures greater than
300°C for more than 10 seconds.
ELECTRICAL CONDUCTIVE EPOXY DIE ATTACH
Use a controlled thickness of approximately 2 mils for best electrical conductivity and lowest thermal
resistance. Cure epoxy per manufacturer’s schedule. Typically 150°C for 1 hour.
RIBBON/WIRE BONDING
Thermo compression wedge or ball bonding may be used to attach ribbons or wire to the gold bonding pads.
A 1/4 x 3 mil gold ribbon is recommended on all RF ports and should be kept as short as possible for the
lowest inductance and best microwave performance.
Ordering Information
Part Number
MA4AGSW1
Package
Waffle Pack
7
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