MA4P7464F-1072T_1 Datasheet, PDF (6/6 Pages) M/A-COM Technology Solutions, Inc. – Non Magnetic SMQ MELF PIN Diode

MA4P7464F-1072T
Non Magnetic SMQ MELF PIN Diode
V2
Mechanical Outline
1072 MELF Surface Mount Package
Dimension
A
B
C
Inches
0.093
0.050
0.060
Milimeters
2.36
1.27
1.52
Circuit Pad Layout for MELF Diodes
Dimension
A
B
C
Package Style
1072
inches
mm
0.093
2.36
0.050
1.27
0.060
1.52
A
C
B
B
MELF Assembly Recommendations
♦ Devices may be soldered using standard 60Sn/40Pb or RoHS compliant solders. All solderable surfaces of MELF
devices are tin plated 50 μM thick to ensure an optimum connection.
♦ For recommended Sn/Pb and RoHS soldering profiles See Application Note M538 on the M/A-COM Tech website.
Part Number
MA4P7464F-1072T
Ordering Information
Package
Tape and Reel
Quantity per Reel
1500pcs
6
ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for
development. Performance is based on target specifications, simulated results, and/or prototype
measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under
development. Performance is based on engineering tests. Specifications are typical. Mechanical
outline has been fixed. Engineering samples and/or test data may be available. Commitment to
produce in volume is not guaranteed.
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information contained herein without notice.