MA4P7441F-1091T_2 Datasheet, PDF (6/6 Pages) M/A-COM Technology Solutions, Inc. – Non Magnetic SMQ MELF PIN Diode

MA4P7441F-1091T
Non Magnetic SMQ MELF PIN Diode
V2
Mechanical Information
1091 MELF Surface Mount Package
Circuit Pad Layout for 1091 MELF Diodes
A
Case Style
Dimensions in Inches (mm)
1091
A Square
B
C
Min / Max Min / Max Min / Max
0.138 / 0.155 0.180 / 0.200 0.008 / 0.030
(3.50/ 3.94) (4.57/ 5.08) (.203 / .762)
Dimension
A
B
C
C
B
B
Package Style
1091
inches
mm
0.150
3.81
0.050
1.27
0.100
2.54
MELF Assembly Recommendations
♦ Devices may be soldered using standard 60Sn/40Pb or RoHS compliant solders. All solderable surfaces of MELF
devices are tin plated 50 μM thick to ensure an optimum connection.
♦ For recommended Sn/Pb and RoHS soldering profiles See Application Note M538 on the M/A-COM Tech website.
Ordering Information
Part Number
MA4P7441F-1091T
Package
Tape and Reel
6
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
• North America Tel: [phone] • Europe Tel: [phone]
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
• India Tel: [phone]
• China Tel: [phone]
Visit www.macomtech.com for additional data sheets and product information.
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.