MA4AGP907 Datasheet, PDF (6/6 Pages) Tyco Electronics – AlGaAs Flip-Chip PIN Diode

MA4AGP907
MA4AGFCP910
AlGaAs
Flip Chip PIN Diodes
RoHS Compliant
Rev. V4
Device Installation Guidelines
Cleanliness
These devices should be handled in a clean environment. The chips are resistant to solvents and may
cleaned using approved industry standard practices.
Static Sensitivity
Aluminum Gallium Arsenide PIN diodes are ESD sensitive and can be damaged by static electricity. Proper
ESD techniques should be used when handling these devices. These devices are rated Class 0, ( 0-199V )
per HBM MIL-STD-883, method 3015.7 [C = 100pF ±10%, R = 1.5kW ±1%]. Even though tested die pass
50V ESD, they must be handled in a static-free environment.
General Handling
The devices have a polymer layer which provides scratch protection for the junction area and the anode air
bridge. Die can be handled with plastic tweezers or picked and placed with a #27 tip vacuum pencil.
Assembly Requirements using Electrically Conductive Silver Epoxy and Solder
These chips are designed to be inserted onto hard or soft substrates with the junction side down. They should be
mounted onto silk-screened circuits using electrically conductive silver epoxy, approximately 1-2 mils in thickness
and cured at approximately 90°C to 150°C per manufacturer’s schedule. For extended cure times, > 30 minutes,
temperatures must be below 200°C.
Eutectic Die Attached
Tin rich solders ( >30% Sn by weight ) are not recommended as they will scavenge the gold on the contact
Pads exposing the tungsten metallization beneath and creating a poor solder connection. Indalloy or 80/20,
Au/Sn type solders are acceptable. Maximum soldering temperature must be kept below 280°C for less
than 10 seconds.
Note:
The MA4AGSBP907 which is a solder bumped version of the MA4AGP907, is also available. The datasheet
can be viewed on the M/A-COM website at: http://www.macom.com/DataSheets/MA4AGSBP907.pdf
Circuit Pad Layout
Ordering Information
Part Number
MA4AGP907
MADP-001907-13050P
Part Number
MA4AGFCP910
MADP-000910-13050P
Packaging
Gel Pack
Pocket Tape
Packaging
Gel Pack
Pocket Tape
0.013”
0.008”
(2) PL
0.012”
(2) PL
6
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typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. _{M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make}
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