MA4SPS552_15 Datasheet, PDF (5/6 Pages) M/A-COM Technology Solutions, Inc. – SURMOUNT PIN Diode

MA4SPS552
SURMOUNTTM PIN Diode
Rev. V3
Handling
All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin
oils. The use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components.
Bulk handling should insure that abrasion and mechanical shock are minimized.
Die Attach
Attachment to a circuit board is made simple through the use of surface mount technology. Mounting pads are
conveniently located on the bottom surface of these devices and are removed from the active junction locations.
These devices are well suited for solder attachment onto hard and soft substrates. The use of 80Au/20Sn and
60Sn/40Pb solder is recommended. Conductive epoxy for attachment may also be used.
When soldering these devices to a hard substrate, hot gas die bonding is preferred. We re-commend utilizing a
vacuum tip and force of 60 to 100 grams applied normal to the top surface of the device.
When soldering to soft substrates, it is recommended to use a lead-tin interface at the circuit board mounting
pads. Position the die so that its mounting pads are aligned with the circuit board mounting pads and reflow the
solder by heating the circuit trace near the mounting pad while applying 60 to 100 grams of force perpendicular to
the top surface of the die. Equal Heat must be applied to both ohmic contacts. Since the HMIC glass is transpar-
ent, the edges of the mounting pads closest to each other can be visually inspected through the die after attach is
completed.
Recommended temperature and re-flow profiles for 60/40, Sn/Pb and RoHS compliant solders are provided in
Application Note M538 , “Surface Mounting Instructions“.
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