MA4SPS552_15 Datasheet, PDF (1/6 Pages) M/A-COM Technology Solutions, Inc. – SURMOUNT PIN Diode

MA4SPS552
SURMOUNTTM PIN Diode
Features
 Surface Mount Device
 No Wirebonds Required
 Rugged Silicon-Glass Construction
 Silicon Nitride Passivation
 Polymer Scratch Protection
 Ultra-Low Parasitic Capacitance and Inductance
 Higher Power Handling (Efficient Heat sinking)
 RoHS* Compliant
Description
The MA4SPS552 is a silicon-glass PIN diode chip
fabricated with MACOM’s patented HMIC process.
This device features two silicon pedestals
embedded in a low loss glass. The diode is formed
on the top of one pedestal and connections to the
backside of the device are facilitated by making the
pedestal sidewalls conductive. Selective backside
metallization is applied producing a surface mount
device. The topside is fully encapsulated with
silicon nitride and has an additional polymer layer
for scratch protection. These protective coatings
prevent damage to the junction and the anode
air-bridge during handling and assembly.
These packageless devices are suitable for usage
in moderate incident power (5 W CW) or higher
incident peak power (200 W, 1 µs, 0.001 Duty)
series, shunt, or series-shunt switches. Small
parasitic inductance, 0.7 nH, and excellent RC
constant (0.20 ps) make the devices ideal for TR
switch and accessory switch circuits, where higher
P1db and IP3 values are required.
These diodes can also be used in π, T, Tapered
Resistance, and Switched-Pad Attenuator Control
Circuits for 50 Ω or 75 Ω systems.
Ordering Information¹
Part Number
Package
MA4SPS552
100 pc. die in carrier
MADP-000552-12810T 3000 pc. pocket tape on reel
1. Reference Application Note M513 for reel size information.
Package Dimensions²
A
Rev. V3
B
C
D EF
G
INCHES
DIM
MIN
MAX
A
0.0207 0.0226
B
0.0108 0.0128
C
0.0040 0.0080
D
0.0075 0.0095
E
0.0032 0.004
F
0.0061 0.0081
G
0.0069 0.0089
2. Backside metal: 0.1 μm thick.
MM
MIN
MAX
0.525
0.575
0.275
0.325
0.102
0.203
0.190
0.241
0.081
0.101
0.155
0.205
0.175
0.225
* Restrictions on Hazardous Substances, European Union Directive 2011/65/EU.
1
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
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