MA4PH611 Datasheet, PDF (5/5 Pages) Tyco Electronics – MELF PIN Diode

MA4PH611
MELF PIN Diode
V1
Assembly Recommendations
• Devices may be soldered using standard Sn63/Pb37 or any RoHS compliant solder. Leads are bright
tin plated to a minimum thickness of 50μm to ensure an optimum connection.
• For recommended Sn/Pb and RoHS soldering time/temperature profiles. See Application Note M538
on the MACOM website.
Handling Procedures
The following precautions should be observed to
avoid damaging these devices.
Cleanliness and Storage
MELF devices should be handled and stored in a
clean environment. The metalized ends of the
device are tin plated for greater solderability and
any continuous exposure to high humidity (>80%)
for extended periods of time may cause the surface
to oxidize. Caution should be taken when storing
devices for extended intervals.
ESD
These devices are susceptible to ESD and are
rated Class 1C.
General Handling
Device can be handled with tweezers or vacuum
pickups and are suitable for use with automatic
pick-and-place equipment.
RoHS
The MA4PH611 is fully RoHS compliant meaning it
contains less than the maximum allowable
concentration of 0.1%, by weight, in homogenous
materials for lead, hex chrome, mercury, PBB,
PBDE, and 0.01% for cadmium.
Mounting Techniques
Solder Attach
Typical wave soldering or reflow techniques may be
used to mount MELF packages to circuit boards.
Alloys such as Sn63/Pb37 or any RoHS compliant
solder may be used. For more information visit the
MACOM website and refer to application note M538.
Note: Click links below to view datasheets of other
MELF and packaged PIN diodes.
PACKAGED_PIN_DIODES
and/or
MA4P MELF & HIPAX SERIES
5
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