MA4PH611 Datasheet, PDF (1/5 Pages) Tyco Electronics – MELF PIN Diode

MA4PH611
MELF PIN Diode
Features
• High Power Handling
• Low Loss / Low Distortion
• Leadless Low Inductance MELF Package
• Surface Mountable
• RoHS Compliant
V1
Package Style 1091
Dot Denotes Cathode
Description
The chip used in the MA4PH611 is manufactured
using a unique, CERMACHIP, passivation process
which provides for a hard glass encapsulation that
protects and hermetically seals the active area of
the chip. This packaged, CERMACHIP, PIN diode
is ideally suited for use in applications where high
RF and DC voltages are present.
The chip is enclosed in a rugged, ceramic, Metal
Electrode Leadless Faced (MELF), surface mount
package that is full face bonded to refractory metal
plugs on both the anode and cathode. The result is
a low loss PIN diode with low thermal resistance
due to its symmetrical thermal paths. MELF PIN
diodes are designed specifically for high volume
tape and reel assembly. Their user friendly design
provides for extremely easy, automatic, pick and
place, indexing and assembly. All solderable
surfaces are tin plated and are compatible with all
industry standard reflow and vapor phase solder
processes.
Applications
The MA4PH611 is well suited for use in low loss, low
distortion, UHF and VHF high power switching circuits.
I
Absolute Maximum Ratings
T_AMB = +25°C (Unless Otherwise Noted) ^1,2
Parameter
Absolute Maximum
D.C. Reverse Voltage
Operating Chip Junction
Temperature
Storage Temperature
1000V
-55°C to +175°C
-55°C to +200°C
Installation Temperature +280°C for 10 Seconds
Notes
1. Operation of this device above any one of these
parameters may cause permanent damage.
2. Please refer to application note M538 for surface
mounting instructions.
1
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is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
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Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. _{M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make}
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.