XB1008-BD_15 Datasheet, PDF (4/7 Pages) M/A-COM Technology Solutions, Inc. – Buffer Amplifier

XB1008-BD
Buffer Amplifier
10.0-21.0 GHz
Mechanical Drawing
1.100
(0.043)
0.355
(0.014)
2
0.955
(0.038)
3
Rev. V1
0.310
(0.012)
1
0.0
4
0.310
(0.012)
5
0.0
0.560
1.100
(0.022)
(0.043)
(Note: Engineering designator is 15MPA0857)
Units:millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness:0.110 +/- 0.010 (0.0043 +/- 0.0004),Backside is ground,Bond Pad/Backside Metallization:Gold
All DCBond Pads (except Vd3) are 0.100 x 0.100 (0.004 x 0.004).All RFBond Pads (and Vd3) are 0.100 x 0.200 (0.004 x 0.008)
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance:+/- 0.005 (+/- 0.0002).Approximate weight:0.75 mg.
Bond Pad #1 (RFIn)
Bond Pad #2 (Vg1)
Bond Pad #3 (Vd)
Bond Pad #4 (RFOut)
Bond Pad #5 (Vg2)
Bias Arrangement
Vd
Vg1
Bypass Capacitors - See App Note [2]
2
3
RF In 1
5
Vg2
4 RF Out
4
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is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
• India Tel: [phone]
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Visit www.macomtech.com for additional data sheets and product information.
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. _{M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make}
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.