MA4BN1840-1 Datasheet, PDF (4/8 Pages) Tyco Electronics – Monolithic HMIC Integrated Bias Network 18 - 40 GHz

MA4BN1840-1
Monolithic HMIC™
Integrated Bias Network
RoHS Compliant
Rev. V3
MILLIMETERS
MILS
DIM
MIN
MAX
MIN
MAX
A
1.475 1.575
58
62
B
1.075 1.175
43
46
C
0.800 0.820 31.5
32.3
D
0.400 0.420 15.7
16.5
E
0.810 0.830 31.9
32.7
F
0.520 0.550 20.5
21.7
RF Bond Pads 0.150 X 0.125 REF. 5.90 X 4.92
DC Bond Pad 0.150 X 0.125 REF. 5.90 X 4.92
Thickness 0.005 REF. 0.125 REF.
Assembly Considerations
Cleanliness
These chips should be handled in a clean environment.
Electro-Static Sensitivity
The MA4BN1840-1 bias network is ESD, Class 1B sensitive. The proper ESD handling procedures should be
used.
Wire Bonding
Thermosonic wedge wire bonding using 0.003” x 0.00025” ribbon or ball bonding with 0.001” diameter gold wire is
recommended. A stage temperature of 150°C and a force of 18 to 22 grams should be used. Ultrasonic energy
should be adjusted to the minimum required. RF bonds should be as short as possible for best performance.
Mounting
These chips have Ti-Pt-Au topside and backside metal. They can be die mounted with either a gold-tin eutectic
solder preform , RoHS compliant solders or electrically conductive silver epoxy. Mounting surface must be clean
of organic contaminants and flat for best adhesion results.
Eutectic Die Attachment
An 80/20 gold-tin eutectic solder preform is recommended with a work surface temperature of 255°C and a tool tip
temperature of 265°C. When hot gas is applied, the tool tip temperature should be 290°C. The chip should not be
exposed to temperatures greater than 320°C for more than 20 seconds. No more than three seconds should be
required for attachment.
Electrically Conductive Epoxy Die Attachment
Assembly should be preheated to 125-150°C. A minimum amount of epoxy should be used, approximately 1 to 2
mils thickness for best electrical and thermal conductivity. A thin epoxy fillet should be visible around the
perimeter of the chip after placement. Cure epoxy per manufacturer’s time-temperature schedule. Typically 150°C
for 1 hour.
RoHS Soldering
See application note M538 page 7 on the M/A-COM website for the recommended heating profile.
4
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