MA4BN1840-1 Datasheet, PDF (1/8 Pages) Tyco Electronics – Monolithic HMIC Integrated Bias Network 18 - 40 GHz

MA4BN1840-1
Monolithic HMIC™
Integrated Bias Network
RoHS Compliant
Features
♦ Broad Bandwidth Specified 18 to 40GHz
♦ Usable 10GHz to 50 GHz
♦ Extremely Low Insertion Loss
♦ High RF-DC Isolation
♦ Rugged, Fully Monolithic Glass Encapsulation
Rev. V3
Description
The MA4BN1840-1 is a fully monolithic broadband bias
network utilizing M/A-COM's HMIC^TM (Heterolithic Micro-
wave Integrated Circuit) process, US Patent 5,268,310.
This process allows the formation of silicon vias by
imbedding them in low loss, low dispersion glass along
with high Q spiral inductors and MIM capacitors. The
close proximity between elements and the combination
of silicon and glass gives this HMIC device low loss and
high performance with exceptional repeatability through
millimeter frequencies.
Large bond pads facilitate the use of low inductance
ribbon bonds, while the gold backside metallization
provides the RF and DC ground. This allows for manual
or automatic die attach via electrically conductive silver
epoxy or RoHS compliant solders. .
Applications
The MA4BN1840-1 bias network is suitable for the
D.C. biasing of PIN diode control circuits. It functions
as an RF-DC de-coupling network as well as the D.C.
return. The device can also be used as a bi-directional
re-active coupler for Schottky detector circuits. D.C.
currents up to 150 mA and D.C. voltages up to 50 V
may be used.
Yellow areas denote bond pads
J1 (IN)
Schematic
J2 (OUT)
Maximum Operating Conditions at +25°C
(Unless otherwise noted)
Parameter
Value
Operating Temperature
Storage Temperature
-65°C to +125°C
-65°C to +150°C
RF & D.C.
Ground
Die Attach Temperature
RF C.W. Incident Power
320°C for 20 sec
10 Watts
D.C. Bias
D.C. Bias Current
+/- 150 mA
D.C. Bias Voltage
1
+/- 50 V
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is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
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typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. _{M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make}
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.