MLP7130-0805-2 Datasheet, PDF (3/5 Pages) M/A-COM Technology Solutions, Inc. – Silicon Limiter PIN Diode

MLP7130-0805-2
Silicon Limiter PIN Diode
Rev. V1
Assembly Instructions
Diodes may be placed onto circuit boards with pick and place manufacturing equipment from tape-reel. The
devices are attached to the circuit using conventional solder re-flow or wave soldering procedures with RoHS type
or Sn 60 / Pb 40 type solders.
Table 1. Time-Temperature Profile for Sn60/Pb40 or RoHS Type Solders
Profile Feature
SnPb Solder Assembly
Pb-Free Solder Assembly
Average Ramp-Up Rate (T_L to T_P)
Preheat:
-Temperature Min (T_SMIN)
-Temperature Max (T_SMAX)
-Time (min to max)(t_S)
T_SMAX to T_L
- Ramp-Up Rate
Time Maintained Above:
-Temperature (T_L)
- Time (t_L)
Peak temperature (T_P)
Time Within 5°C of Actual
Peak Temperature (t_P)
Ramp-Down Rate
3°C /second maximum
100°C
150°C
60 - 120 s
183°C
60 - 150 s
225 +0/-5°C
10 – 30 s
6°C /s maximum
3°C /second maximum
150°C
200°C
60 - 180 s
3°C /s maximum
217°C
60 - 150 s
260 +0/-5°C
20 – 40 s
6°C /s maximum
Time 25°C to Peak Temperature
6 minutes maximum
8 minutes maximum
Figure 1. Solder Re-Flow Time-Temperature Profile
3
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