MA4FCP305 Datasheet, PDF (3/3 Pages) Tyco Electronics – Silicon Flip Chip PIN Diode

MA4FCP305
Flip Chip PIN Diode
RoHS Compliant
Rev. V4
Handling Procedures
All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin
oils. The use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components.
Bulk handling should insure that abrasion and mechanical shock are minimized.
Bonding Techniques
These devices were designed for insertion onto hard or soft substrates with the junction side down. They can be
mounted with electrically conductive epoxy or with a low temperature solder preform. However, Sn rich solders
are not recommended due to the tungsten metallization scheme beneath the gold contacts. Indalloy or
80/20, Au/Sn, solders are acceptable. Maximum soldering temperature must be < 300°C for < 10 sec. These
chips are designed to be inserted onto hard or soft substrates with the junction side down. They should be
mounted onto silkscreened circuits using electrically conductive Ag epoxy, approximately 1-2 mils in
thickness and cured at approximately 90°C to 150°C per manufacturer’s schedule. For extended cure times,
> 30 minutes, temperatures must be below 200 °C. The die can also be assembled with the junction side up,
and wire or ribbon bonds made to the pads.
Circuit Mounting Dimensions ( Inches )
0.013”
0.012” (2) PL
0.008”
(2) PL
Ordering Information
The MA4FCP305 flip chip diode may be ordered in either waffle packs, tape and reel or 6” rings mounted on
tape per the table below. Tape and reel dimensions are provided in Application Note M513 located on the
M/A-COM website @ www.macom.com.
Part Number
MA4FCP305
MADP-007161-01269T
MADP-000305-12690R
Packaging
Die in Waffle Pack
Tape & Reel
Wafer on Tape Frame
3
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