MA4EXXXX Datasheet, PDF (3/7 Pages) M/A-COM Technology Solutions, Inc. – Low Series Resistance

MA4EXXXX Series
GaAs Flip Chip
Schottky Barrier Diodes
Absolute Maximum Ratings^5,6
Parameter
Absolute Maximum
Operating Temperature
-65°C to +125°C
Storage Temperature
-65°C to +150°C
Incident LO Power
+20 dBm
Incident RF Power
+20 dBm
Mounting Temperature
+235°C for 10 seconds
5. Exceeding any one or combination of these limits may cause
permanent damage to this device.
6. MACOM does not recommend sustained operation near these
survivability limits.
Rev. V9
Forward Current vs. Temperature
100
80
+25°C
-50°C
+125°C
60
40
20
0
0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
Forward Voltage (V)
Mounting Techniques
These chips were designed to be inserted onto
hard or soft substrates with the junction side down.
They can be mounted with conductive epoxy or
with a low temperature solder preform. The die
can also be assembled with the junction side up,
and wire or ribbon bonds made to the pads.
Solder Die Attach:
Solder which does not scavenge gold, such as
Indalloy # 2, is recommended. Sn-Pb based
solders are not recommended due to solder
embrittlement. Do not expose die to a temperature
greater than 235°C, or greater than 200°C for
longer than 10 seconds. No more than three
seconds of scrubbing should be required for
attachment.
Epoxy Die Attach:
Assembly can be preheated to 125 - 150°C. Use a
minimum amount of epoxy. Cure epoxy as per
manufacturer’s schedule. For extended cure times,
temperatures should be kept below 200°C.
Handling Procedures
The following precautions should be observed to
avoid damaging these chips:
Cleanliness:
The chips should be handled in a clean
environment. Do not attempt to clean die after
installation.
Static Sensitivity:
Schottky barrier diodes are ESD sensitive and can
be damaged by static electricity. Proper ESD
techniques should be used when handling these
Class 0 devices.
General Handling:
The protective polymer coating on the active areas
of these die provides scratch protection, particularly
for the metal air bridge which contacts the anode.
Die can be handled with tweezers or vacuum
pickups and are suitable for use with automatic
pick-and-place equipment.
3
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