MA4EX950H1-1225T_V3 Datasheet, PDF (3/3 Pages) M/A-COM Technology Solutions, Inc. – Silicon Double Balanced HMIC Mixer

MA4EX950H1-1225T
Silicon Double Balanced HMIC Mixer
700 - 1200 MHz
Case Styles
SOT-25
DIM
A
B
C
D
E
F
G
H
J
INCHES
MIN
MAX
0.106
0.122
0.100
0.118
-
0.051
.063 REF.
0.032
0.043
0.014
0.020
0.003
-
0.000
0.006
0.018 REF.
MILLIMETERS
MIN
MAX
2.70
3.10
2.54
3.00
-
1.30
1.60 REF.
0.80
1.10
0.35
0.50
0.08
-
0.00
0.15
0.45 REF
Mounting Information
The illustration indicates the recommended
mounting pad configuration for the
SOT-25 package. Solder paste containing flux
should be screened onto the pads to a thickness of
0.005- 0.007 inches. The plastic package is placed
in position, firmly adhering to the solder paste.
Permanent attachment is performed by a reflow
soldering procedure during which the tab
temperature does not exceed +275 °C and the body
temperature does not exceed +260 °C for the RoHS
compliant devices.
Please refer to Application Note M538 for surface
mounting instructions.
M/A-COM Products
Rev. V3
2. Leads Coplanarity should be 0.003 (0.08) max.
3
ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for
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development. Performance is based on target specifications, simulated results, and/or prototype
measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under develop-
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ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has
been fixed. Engineering samples and/or test data may be available. Commitment to produce in
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
volume is not guaranteed.
changes to the product(s) or information contained herein without notice.