MA4SPS502_15 Datasheet, PDF (2/4 Pages) M/A-COM Technology Solutions, Inc. – SURMOUNT PIN Diode

MA4SPS502
SURMOUNT^TM PIN Diode
Symbol
C_T
R_S
V_F
V_R
I_R
θ_JL
T_L
Electrical Specifications @ T_AMB = +25°C
Conditions
-40V, 1MHz
-40V, 1GHz
100mA, 100MHz
20mA, 100MHz
10mA
10μA
-200V
-40V
Steady State
+10mA / -6mA
( 50% - 90% V )
Units
pF
pF


V
V
μA
nA
°C/W
μS
Min.
| -200 |
Typical
0.140
0.090
1.4
2.4
0.87
| -275 |
8
50
2.8
Rev. V2
Max.
0.200
2.2
3.2
1.00
| -10 |
Handling
All semiconductor chips should be handled with care
to avoid damage or contamination from perspiration
and skin oils. The use of plastic tipped tweezers or
vacuum pickups is strongly recommended for individ-
ual components. Bulk handling should ensure that
abrasion and mechanical shock are minimized.
Die Attach
Attachment to a circuit board is made simple through
the use of surface mount technology. Mounting pads
are conveniently located on the bottom surface of
these devices and are removed from the active junc-
tion locations. These devices are well suited for solder
attachment onto hard and soft substrates. The use of
80/20, Au/Sn or RoHS compliant solders is recom-
mended. A conductive silver epoxy may also be
used .
When soldering these devices to a hard substrate, hot gas
die bonding is preferred. We recommend utilizing a vac-
uum tip and force of 60 to 100 grams applied to the top
surface of the device. When soldering to soft substrates, it
is recommended to use a Gold-Tin interface at the circuit
board mounting pads. Position the device so that its
mounting pads are force aligned with the circuit board
mounting pads and reflow the solder by heating the circuit
trace near the mounting pads while applying 60 to 100
grams of perpendicular to the top surface of the die.
The solder joint must not be made one pad at a time.
Doing so could create unequal heat flow and produce
thermal and/or mechanical stresses. It is also not recom-
mended to reflow solder by causing heat to flow through
the top surface of the die. Since the HMIC glass is trans-
parent, the edges of the mounting pads can be visually
inspected through the die after attach is completed.
2
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
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Visit www.macomtech.com for additional data sheets and product information.
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.