MA4PBL027 Datasheet, PDF (2/5 Pages) Tyco Electronics – HMICTM Silicon Beam-Lead PIN Diodes

MA4PBL027
HMIC^TM Silicon Beam-Lead PIN Diodes
Electrical Specifications at +25°C
Rev. V1
Symbol
C_T
C_T
C_T
C_T
C_T
C_T
C_T
C_T
C_T
C_T
C_T
C_T
R_S
R_S
R_S
R_S
V_F
V_R
I_R
I_R
TL
Conditions
0V, 1MHz ²
-3V, 1MHz ²
-10V, 1MHz ²
-40V, 1MHz ²
0V, 100MHz ^2,4
-3V, 100MHz ^2,4
-10V, 100MHz ^2,4
-40V, 100MHz ^2,4
0V, 1GHz ^2,4
-3V, 1GHz ^2,4
-10V, 1GHz ^2,4
-40V, 1GHz ^2,4
10mA, 100 MHz ^3,4
20mA, 100 MHz ^3,4
10mA, 1GHz ^3,4
20mA, 1GHz ^3,4
20mA
-10µA
-40 V
-90 V
+10mA / -6mA
Units
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
Ω
Ω
Ω
Ω
V
V
nA
uA
ns
Typ
0.048
0.039
0.033
0.030
0.043
0.033
0.031
0.027
0.039
0.032
0.029
0.026
3.8
3.0
3.5
2.8
0.917
110
1.0
-
110
Max
0.040
0.040
1.1
10.0
Notes:
2. Total capacitance, C_T, is equivalent to the sum of Junction
Capacitance ,Cj, and Parasitic Capacitance, Cpar.
3. Series resistance R_S is equivalent to the total diode resistance :
Rs = Rj ( Junction Resistance) + Rc ( Ohmic Resistance)
4. Rs and C_T are measured on an HP4291A Impedance Analyzer
with die mounted in an ODS-186 package with conductive
silver epoxy.
Die Handling
All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin oils. The use
of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components. Bulk handling should insure
that abrasion and mechanical shock are minimized.
Die Bonding
These devices were designed to be inserted onto hard or soft substrates. Recommended methods of attachment include
thermocompression bonding, parallel-gap welding, and electrically conductive silver epoxy.
See Application Note M541, “Bonding and Handling Procedures for Chip Diode Devices” for More Detailed Assembly
Instructions.
2
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology
Solutions is considering for development. Performance is based on target specifications,
simulated results, and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications
are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be
available. Commitment to produce in volume is not guaranteed.
• North America Tel: [phone] • Europe Tel: [phone]
• India Tel: [phone]
• China Tel: [phone]
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.