MA4E2544L-1282 Datasheet, PDF (2/4 Pages) M/A-COM Technology Solutions, Inc. – SURMOUNTTM Schottky Diode Low Barrier Cross-Over Quad Chip

MA4E2544L-1282
SURMOUNT^TM Schottky Diode
Low Barrier Cross-Over Quad Chip
Rev V2
Electrical Specifications @ + 25 °C (Measured as Single Diodes)
Model
Number
MA4E2544L-1282
Type
Recommended
Frequency Range
Vf @ 1 mA
( mV )
Low
Barrier
DC - 18 GHz
330 Max
300 Typ
ΔVf @ 1mA
( mV )
10 Max
Ct @ 0V
( pF )
0.22 Max
0.15 Typ
Rt Slope Resistance
( Vf1–Vf2 ) /
( 10.5mA – 9.5mA )
(Ω)
16 Typical
20 Max
Rt is the dynamic slope resistance where Rt = Rs + Rj where Rj =26 / Idc ( Idc is in mA ) and Rs is the Ohmic Resistance.
Absolute Maximum Ratings @ 25 °C ¹
Die Bonding
Parameter
Operating Temperature
Storage Temperature
Junction Temperature
Forward Current
Absolute Maximum
-40 °C to +150 °C
-40 °C to +150 °C
+175 °C
20 mA
Die attach for these devices is made simple
through the use of surface mount die attach tech-
nology. Mounting pads are conveniently located on the
bottom surface of these devices, and are opposite
the active junction. The devices are well suited for
high temperature solder attachment onto hard
substrates. 80Au/20Sn and 63/Pb36 solders are
acceptable for usage.
Reverse Voltage l - 10 μ A l
RF C.W. Incident Power
RF & DC Dissipated Power
I -5 V I
+20 dBm C.W.
50 mW
Handling Procedures
All semiconductor chips should be handled with care
to avoid damage or contamination from perspiration
and skin oils. The use of plastic tipped tweezers or
vacuum pickups is strongly recommended for individual
components. The top surface of the die has a protective
polyimide coating to minimize damage.
The rugged construction of these Surmount devices
allows the use of standard handling and die attach
techniques. It is important to note that industry standard
electrostatic discharge (ESD) control is required at
all times, due to the sensitive nature of Schottky
junctions. Bulk handling should insure that abrasion
and mechanical shock are minimized.
For Hard substrates, we recommend utilizing a
vacuum tip and force of 60 to 100 grams applied
uniformly to the top surface of the device, using a
hot gas bonder with equal heat applied across the
bottom mounting pads of the device. When solder-
ing to soft substrates, it is recommended to use a
lead-tin interface at the circuit board mounting
pads. Position the die so that its mounting pads are
aligned with the circuit board mounting pads. Re-
flow the solder paste by applying equal heat to the
circuit at both die-mounting pads. The solder joint
must Not be made one at a time, creating un-equal
heat flow and thermal stress. Solder reflow should
not be performed by causing heat to flow through
the top surface of the die. Since the HMIC glass
is transparent, the edges of the mounting pads can
be visually inspected through the die after die at-
tach is completed.
2
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is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
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Solutions has under development. Performance is based on engineering tests. Specifications are
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changes to the product(s) or information contained herein without notice.