MA4E2544L-1282 Datasheet, PDF (1/4 Pages) M/A-COM Technology Solutions, Inc. – SURMOUNTTM Schottky Diode Low Barrier Cross-Over Quad Chip

MA4E2544L-1282
SURMOUNT^TM Schottky Diode
Low Barrier Cross-Over Quad Chip
Features
• Ultra Low Parasitic Capacitance and Inductance
• Surface Mountable in Microwave Circuits , No Wire
bonds Required
• Rugged HMIC Construction with Polyimide Scratch
Protection
• Reliable, Multilayer Metallization with a Diffusion
Barrier, 100% Stabilization Bake (300 °C, 16 hours)
• Lower Susceptibility to ESD Damage
Topview
A
Rev V2
Description and Applications
The MA4E2544L-1282 Series Surmount
Silicon Schottky Cross-Over Quad Diodes are fabricated
with the patented Heterolithic Microwave Integrated Cir-
cuit (HMIC) process. HMIC circuits consist of Silicon pedes-
tals which form diodes or via conductors embedded in a
glass dielectric, which acts as the low dispersion, low loss,
microstrip transmission medium. The combination of silicon
and glass allows HMIC devices to have excellent loss and
power dissipation characteristics in a low profile, reliable device.
This Surmount Schottky device is an excellent choice for
circuits requiring the small parasitics of a beam lead de-
vice coupled with the superior mechanical performance of a
chip. The Surmount structure employs very low resistance sili-
con vias to connect the Schottky contacts to the metalized
mounting pads on the bottom surface of the chip. These
devices are reliable, repeatable, and a lower cost per-
formance solution to conventional devices. They have
lower susceptibility to electrostatic discharge than con-
ventional beam lead Schottky diodes.
The multi-layer metallization employed in the fabrication of the
Surmount Schottky junctions includes a platinum diffusion
barrier, which permits all devices to be subjected to a 16-hour
non-operating stabilization bake at 300°C.
This device is recommended for use in microwave cir-
cuits through Ku-Band frequencies for lower power appli-
cations such as mixers, sub-harmonic mixers, detectors
and limiters. The HMIC construction facilitates the direct
replacement of more fragile beam lead diodes with the
corresponding Surmount diode which can be connected
to a hard or soft substrate circuit with solder.
The “0505” outline allows for Surface Mount placement
and multi-functional polarity orientations.
B
D
E
Case Style 1307
C
D
MA4E2544L-1282
Equivalent Circuit
Dim
A
B
C
D Sq.
E Sq.
Inches
Min.
0.0445
0.0445
Max.
0.0465
0.0465
0.0040 0.0080
0.0128 0.0148
0.0128 0.0148
Millimeters
Min.
1.130
1.130
Max.
1.180
1.180
0.102 0.203
0.325 0.375
0.325 0.375
1
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is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
• India Tel: [phone]
• China Tel: [phone]
Visit www.macomtech.com for additional data sheets and product information.
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. _{M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make}
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.