MA4E2508 Datasheet, PDF (2/4 Pages) Tyco Electronics – SURMOUNTTM Low and Medium & High Barrier Silicon Schottky Diodes: Anti-Parallel Pair

MA4E2508 Series
SURMOUNT^TM Low, Medium, & High Barrier Silicon
Schottky Diodes: Anti-Parallel Pair
M/A-COM Products
Rev. V3
Electrical Specifications @ 25°C ^1,2
Model
Number
Type
Recommended
Freq. Range
Vf @ 1 mA
(mV)
Ct @ 0 V
(pF)
Rt Slope Resistance
(Vf1 - Vf2) / (10.5 mA - 9.5 mA)
(Ω)
MA4E2508L Low Barrier
MA4E2508M Medium Barrier
MA4E2508H High Barrier
DC - 18 GHz
DC - 18 GHz
DC - 18 GHz
330 Max
300 Typ
470 Max
420 Typ
700 Max
650 Typ
0.24 Max
0.18 Typ
0.24 Max
0.18 Typ
0.24 Max
0.18 Typ
16 Typical
20 Max
12 Typical
18 Max
6 Typical
8 Max
1. Rt is the dynamic slope resistance where Rt = Rs + Rj, where Rj = 26 / Idc (Idc is in mA) and Rs is the ohmic resistance.
2. Max forward voltage difference ΔVf @ 1mA: 10mV
Absolute Maximum Ratings @ 25°C
Applications
(unless otherwise noted) ¹
The MA4E2508 Family of Surmount Schottky diodes
are recommended for use in microwave circuits
through Ku band frequencies for lower power applica-
tions such as mixers, sub-harmonic mixers, detectors
and limiters. The HMIC construction facilitates the
direct replacement of more fragile beam lead diodes
with the corresponding Surmount diode, which can be
connected to a hard or soft substrate circuit with sol-
der.
Parameter
Operating Temperature
Storage Temperature
Junction Temperature
Forward Current
Reverse Voltage
RF C.W. Incident Power
Absolute Maximum
-40°C to +125°C
-40°C to +150°C
+175°C
20 mA
5V
+20 dBm
Handling
RF & DC Dissipated Power
50 mW
All semiconductor chips should be handled with care
to avoid damage or contamination from perspiration
Electrostatic Discharge
( ESD ) Classification ²
Class 0
and skin oils. The use of plastic tipped tweezers or
vacuum pickups is strongly recommended for individ-
ual components. The top surface of the die has a
protective polyimide coating to minimize the damage.
1. Exceeding any of these values may cause permanent
damage.
2. Human Body Model
Die Bonding
The rugged construction of these Surmount devices
allows the use of standard handling and die attach
techniques. It is important to note that industry stan-
dard electrostatic discharge (ESD) control is required
at all times, due to the sensitive nature of Schottky
junctions. Bulk handling should insure that abrasion
and mechanical shock are minimized.
For hard substrates, we recommend utilizing a vac-
uum tip and force of 60 to 100 grams applied uni-
formly to the top surface of the device, using a hot gas
bonder with equal heat applied across the bottom
mounting pads of the device. When soldering to soft
substrates, it is recommended to use a lead-tin inter-
face at the circuit board mounting pads. Position the
Die Bonding
Die attach for these devices is made simple through
the use of surface mount die attach technology.
Mounting pads are conveniently located on the bottom
surface of these devices, and are opposite the active
junction. The devices are well suited for higher tem-
perature solder attachment onto hard substrates.
80Au/20Sn and Sn63/Pb37 solders are acceptable for
usage.
2
die so that its mounting pads are aligned with the cir-
cuit board mounting pads. Reflow the solder paste by
applying equal heat to the circuit at both die-mounting
pads. The solder joint must not be made one at a
time, creating un-equal heat flow and thermal stress.
Solder reflow should not be performed by causing
heat to flow through the top surface of the die. Since
the HMIC glass is transparent, the edges of the
mounting pads can be visually inspected through the
die after die attach is completed.
ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for
development. Performance is based on target specifications, simulated results, and/or prototype
measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under develop-
ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has
been fixed. Engineering samples and/or test data may be available. Commitment to produce in
volume is not guaranteed.
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