ANI-010 Datasheet, PDF (2/2 Pages) M/A-COM Technology Solutions, Inc. – Reflow Soldering Guidelines for RoHS* Compliant VCOs and Synthesizers

ANI-010
Reflow Soldering Guidelines for RoHS* Compliant
VCOs and Synthesizers
Rev. -
General Soldering Precautions: Lead-Free Soldering Process
Relation of qualification profile and actual produc-
tion profile
The profiles listed in this document are not
production reflow profiles, but are related to those
profiles with an added margin of safety to account
for oven variation, temperature drift, and product
variation and process robustness.
The actual profile used in production will be dictated
primarily by the solder composition selected.
Process Requirements
To minimize the thermal stress to which these compo-
nets are subjected. Always preheat the printed circuit
board (failure to do so can cause excessive thermal shock
and stress that can result in damage to the component).
The ovens used should be 100% convection reflow.
We recommended 90 seconds above 217°C with a
maximum temperature not to exceed 260°C.
Condition
Average ramp-up rate (30°C to 217°C)
> 100°C
> 150°C
> 217°C
Peak Temperature
Cool-down rate (Peak to 50°C)
Time from 30°C to 255°C
All temperatures shown are +5/-0°C
Exposure
less than 3°C / second
between 360-600 seconds
at least 240 seconds
at least 90 seconds
255°C at least 15 seconds
less than 6°C / second
no greater than 360 seconds
2
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
• North America Tel: [phone] • Europe Tel: [phone]
• India Tel: [phone]
• China Tel: [phone]