ANI-010 Datasheet, PDF (1/2 Pages) M/A-COM Technology Solutions, Inc. – Reflow Soldering Guidelines for RoHS* Compliant VCOs and Synthesizers

ANI-010
Reflow Soldering Guidelines for RoHS* Compliant
VCOs and Synthesizers
Rev. -
Introduction
This application note describes recommended prac-
tices and guidelines for the successful assembly of
M/A-COM VCOs and Synthesizers using automated
solder reflow techniques.
Incorrect handling, storage, reflow and cleaning may
damage the components.
Handling and Storage Precautions
M/A-Com VCOs and Synthesizers are static and mois-
ture sensitive and are packaged accordingly.
Appropriate handling precautions should be observed.
The typical shelf life of these components once re-
moved from the protective reel bag is 168hrs.
Exposure to static electricity or over voltage may cause
defects in the product or degrade it’s reliability.
Components should also be stored in such a way so
as to avoid exposure to corrosive, salty or dusty at-
mospheres, high humidity, direct sunlight and strong
electric fields.
Solder Pad Layout
Each VCO and Synthesizer data sheet recommends
a solder pad layout based on IPC standards.
Deviation from these recommended layouts can
adversely effect the solder joint strength and integrity.
Component Construction
All M/A-Com VCOs and Synthesizers are designed to
withstand solder reflow conditions, as recommended
in this application note.
The table below details the construction of M/A-Com
VCOs and Synthesizers.
Component Construction
Substrate Type
Plating Construction
Cover Material
FR-4
Leadless
Electroless Nickel Immersion Gold Brass (nickel plated)
ENIG
Solder Selection
When selecting solder paste, parameters such as flux
type, particle size and metal content should also be
considered. The solder paste should be carefully se-
lected to suit all of the relevant process parameters
being used.
M/A-Com VCOs and Synthesizers are designed to
work with most recommended reflow profiles for the
SAC305/SAC405 type solders, and are fully compatible
with the standard reflow profiles used for the SN60,
SN62 and SN63 solder pastes, including no-clean
pastes.
Silk screen techniques can control paste thickness
well enough to keep it in the optimum range; the
thickness being a function of the screen mesh, emul-
sion thickness and printer set up parameters.
A stencil technique can also achieve similar results
by using a stencil made of 0.2 mm (0.008 inch) thick
brass or stainless steel.
The stencil or screen opening should be the same
size as the pads on the footprint (1:1 registration),
excluding any solder resist mask areas.
Solder Screen Guidelines
A solder screen or stencil is required to screen the
minimum amount of solder paste onto the pads of the
footprint. This amount or thickness will directly affect
the quality of the solder joint.
The optimum thickness is 0.18 mm to 0.25 mm
(0.007 inch to 0.010 inch).
Component Placement
M/A-Com VCOs and Synthesizers are designed for
placement using automatic Pick and Place equip-
ment.
Component placement is critical to negate shorts
caused by solder bridging.
* Restrictions on Hazardous Substances, European Union Directive 2002/95/EC.
1
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changes to the product(s) or information contained herein without notice.
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