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SMD075-LO81 Datasheet, PDF (6/17 Pages) Lumileds Lighting Company – Mid-Power LED Light Source
Recommended Reflow Profile and Solder Pad
Reflow Soldering Characteristics
Figure 1. Temperature profile for Table 8.
JEDEC 020c
Profile Feature
Table 8.
Lead Free Assembly
Average Ramp-Up Rate (Tsmax to Tp)
Preheat Temperature Min (Tsmin)
Preheat Temperature Max (Tsmax)
Preheat Time (tsmin to tsmax)
Temperature (TL)
Time Maintained Above Temperature TL (tL)
Peak / Classification Temperature (TP)
Time Within 5°C of Actual Peak Temperature (tP)
Ramp-Down Rate
3°C / second max
150°C
200°C
60 - 120 seconds
217°C
60 - 150 seconds
260°C
10 - 30 seconds
6°C / second max
Time 25°C to Peak Temperature
8 minutes max
Note for Table 8:
- All temperatures refer to the application Printed Circuit Board (PCB), measured on the surface adjacent to the package body.
SignalSure Datasheet DS11 20121212
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