L135-27800BHV00001 Datasheet, PDF (6/21 Pages) Lumileds Lighting Company – High voltage package that reduces system BOM while achieving high efficacy

Reflow Soldering Characteristics
Figure 1. Temperature profile for Table 5.
Table 5. Reflow Profile in Accordance with J-Std-020D
Profile Feature
Preheat/Soak:
Temperature Min (Ts_min )
Temperature Max (Ts )
max
Maximum Time (ts) from Ts to Ts
min
max
Ramp–up Rate(T to T )
L
p
Liquidous Temperature ( T_L )
Maximum Time (t ) Maintained T
L
L
Maximum Peak Package Body Temperature (T )
p
Time (t ) within 5°C of the specified temperature (T )
p
c
Maximum Ramp-Down Rate (T to T )
p
L
Maximum Time 25°C to Peak Temperature
Lead Free Assembly
150°C
200°C
120 seconds
3°C / second
217°C
150 seconds
260°C
10 - 30 seconds
6°C / second
8 minutes
Notes for Table 5:
1. All temperatures refer to the application Printed Circuit Board (PCB), measured on the surface adjacent to the package body.
LUXEON 3535 HV Datasheet DS206 20140305 ©2014 Philips Lumileds Lighting Company.
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