L130-2780003000W21 Datasheet, PDF (6/23 Pages) Lumileds Lighting Company – Hot color targeted 6V QFN package delivering high flux

Reflow Soldering Characteristics
Figure 1. Temperature Profile for Table 5.
Table 5.
Profile Feature
Preheat/Soak:
Temperature Min ( T_smin )
Temperature Max ( Ts_max )
Maximum Time (ts) from Ts_min to Ts_max
Ramp-Up Rate ( T to T )
L
p
Liquidous Temperature (T_L)
Maximum Time ( t_L ) Maintained T_L
Maximum Peak Package Body Temperature ( T_P )
Time ( t ) Within 5°C of the Specified Temperature ( T )
p
C
Maximum Ramp-Down Rate ( T to T )
p
L
Maximum Time 25°C to Peak Temperature
Note for Table 5:
1. All temperatures refer to the application Printed Circuit Board (PCB), measured on the surface adjacent to the package body.
Lead Free Assembly
150°C
200°C
120 seconds
3°C / second
217°C
150 seconds
260°C
10 - 30 seconds
6°C / second
8 minutes
LUXEON 3030 2D Datasheet DS207 20140318 ©2014 Philips Lumileds Lighting Company.
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