BTM410 Datasheet, PDF (21/25 Pages) Laird Tech Smart Technology – modules from Laird are designed to meet the needs of developers who wish to add robust

BTM410/411
Bluetooth^® AT Data Module Datasheet
Figure 6-1: BTM410 and BTM411 Shipping Tray Details
6.3 Reflow Parameters
Laird’s surface mount modules are designed to be easily manufactured, including reflow
soldering to a PCB. Ultimately it is the responsibility of the customer to choose the appropriate
solder paste and to ensure oven temperatures during reflow meet the requirements of the solder
paste. Laird Technologies’ surface mount modules conform to J-STD-020D1 standards for reflow
temperatures.
IMPORTANT: During reflow, modules should not be above 260°C and not for more than 30
seconds.
Figure 6-2: Recommended Reflow Temperature
Temperatures should not exceed the minimums or maximums presented in Table 6-1.
Table 6-1: Recommended Maximum and minimum temperatures
Specification
Value Unit
Temperature Inc./Dec. Rate
3
°C /
(max)
Sec
Temperature Decrease rate
(goal)
2-3
°C /
Sec
Soak Temp Increase rate (goal) .5 - 1 °C /
Sec
Flux Soak Period (Min)
60
Sec
Flux Soak Period (Max)
90
Sec
Flux Soak Temp (Min)
150 °C
Flux Soak Temp (max)
190 °C
Time Above Liquidous (max)
60
Sec
Time Above Liquidous (min)
20
Sec
Embedded Wireless Solutions
21
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