L9D345G72BG5 Datasheet, PDF (1/155 Pages) LOGIC Devices Incorporated – 4.5 Gb, DDR3, 64 M x 72 Integrated Module (IMOD)

ADVANCE INFORMATION L9D345G72BG5
4.5 Gb, DDR3, 64 M x 72 Integrated Module (IMOD)
FEATURES
DDR3 Integrated Module [iMOD]:
• Vcc=VccQ=1.5V ± 0.075V
• 1.5V center-terminated, push/pull
I/O
• Package: 25mm x 25mm, 16 x 16
matrix w/ 255 balls
• Matrix ball pitch: 1.00mm
Space saving footprint
Thermally enhanced, Impedance
matched, integrated packaging
Differential, bidirectional data strobe
8n-bit prefetch architecture
8 internal banks (per word, 9 Bytes
integrated in package)
Nominal and dynamic on-die termina-
tion (ODT) for data, strobe, and mask
signals.
CAS (READ) latency (CL): 6, 8, and
10
CAS (WRITE) latency (CWL): 6, 7
and 8
Fixed burst length (BL) of 8 and burst
chop (BC) of 4
Selectable BC4 or BL8 on-the-fly
(OTF)
Self/Auto Refresh modes
Operating Temperature Range (Case
Temp=Tc)
• Industrial: -40˚C to 85˚C supporting
SELF & AUTO REFRESH
• Extended: -40˚C to 105˚C; manual
REFRESH only
• Mil-Temp: -55˚C to 125˚C; manual
REFRESH only
CORE clocking frequencies:
• Industrial: 667MHz, 533MHz and
400MHz
• Extended: 533MHz and 400MHz
• Mil-Temp: 400MHz
Data Transfer Rates:
• Industrial: 1333, 1066 and 800
Mbps
• Extended: 1066 and 800 Mbps
• Mil-Temp: 800 Mbps
Write leveling
Multipurpose register
Output Driver Calibration
Benefits
20% space savings while provid-
ing a surface mount friendly pitch
(1.00mm)
Reduced I/O (46%)
25% improvement in routings for your
memory array
Reduced trace lengths due to
the highly integrated, impedance
matched packaging
Thermally enhanced packaging
technology allow silicon integration
without performance degradation due
to power dissipation (heat)
High TCE organic laminate inter-
poser for improved glass stability
over a wide operating temperature
Suitability of use in High Reliability
applications requiring Mil-temp, non-
hermetic device operation
*Note: This integrated product is currently under
consideration. Latest product status, information, and/
or corresponding documents should be obtained from
LDI prior to your design considerations.
iMOD Part Information
ORDER NUMBER SPEED GRADE DEVICE GRADE PKG FOOTPRINT I/O
L9D345G72BG5I15
L9D345G72BG5E19
L9D345G72BG5M25
DDR3-1333
DDR3-1066
DDR3-800
Industrial
Extended
Mil-Temp
25mm x 25mm
255
PITCH PKG NO.
1.00mm
BG5
LOGIC Devices Incorporated
www.logicdevices.com
integrated module products
1
High Performance, Integrated Memory Module Product
Jul 06, 2009 LDS-L9D345G72BG5-A