SP3002 Datasheet, PDF (7/8 Pages) Littelfuse – Low Capacitance ESD Protection Array

SPA™ Silicon Protection Array Products
Low Capacitance ESD Protection Array
Part Numbering System
SP 3002-04 XT G
Silicon
Protection
Array
Series
Number of Channels
-04 = 4 channel
G= Green
T= Tape & Reel
Package
H = SOT23-6
J = SC70-6
U = uDFN-6
Part Marking System
E X4
EX4
Product Series
E = SP3002 series
Number of Channels
Assembly Site
(varies)
Ordering Information
Part Number
SP3002-04HTG
SP3002-04JTG
SP3002-04UTG
Package
SOT23-6
SC70-6
uDFN-6 (1.6x1.6x0.5mm)
Embossed Carrier Tape & Reel Specification - SC70-6
Product Characteristics
Lead Plating
Lead Material
SC70 & SOT23: Matte Tin
uDFN: Pre-Plated Frame
Copper Alloy
Lead Coplanarity
0.0004 inches (0.102mm)
Subsitute Material
Silicon
Body Material
Molded Epoxy
Flammability
UL94-V-0
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. All specifications comply to JEDEC SPEC MO-223 Issue A
5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
6. Package surface matte finish VDI 11-13.
Marking
EX4
EX4
EX4
Min. Order Qty.
3000
3000
3000
Symbol
E
F
P2
D
D1
P0
10P0
W
P
A0
B0
K0
t
Millimetres
Min
Max
1.65
1.85
3.45
3.55
1.95
2.05
1.40
1.60
1.00
1.25
3.90
4.10
40.0+/- 0.20
7.70
8.10
3.90
4.10
2.14
2.34
2.24
2.44
1.12
1.32
0.27 Max
Inches
Min
Max
0.064
0.073
0.135
0.139
0.077
0.081
0.055
0.063
0.039
0.049
0.154
0.161
1.574+/-0.008
0.303
0.318
0.153
0.161
0.084
0.092
0.088
0.096
0.044
0.052
0.010 Max
©2009 Littelfuse, Inc.
49
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
SP3002 Lead-Free/Green Series