SP3002 Datasheet, PDF (5/8 Pages) Littelfuse – Low Capacitance ESD Protection Array

SPA™ Silicon Protection Array Products
Low Capacitance ESD Protection Array
Package Dimensions - SC70-6
ee
654
E HE
1 23
B
D
A2 A
A1
C
Solder Pad Layout
L
Package Dimensions - SOT23-6
Recommended Solder Pad Layout
M
P
R
O
Package
Pins
JEDEC
A
A1
A2
B
c
D
E
e
HE
L
SC70-6
6
MO-203 Issue A
Millimeters
Inches
Min
Max
Min
Max
0.80
1.10
0.031
0.043
0.00
0.10
0.000
0.004
0.70
1.00
0.028
0.039
0.15
0.30
0.006
0.012
0.08
0.25
0.003
0.010
1.85
2.25
0.073
0.089
1.15
1.35
0.045
0.053
0.65 BSC
0.026 BSC
2.00
2.40
0.079
0.094
0.26
0.46
0.010
0.018
Package
SOT23-6
Pins
6
JEDEC
MO-203 Issue A
Millimeters
Min
Max
Inches
Min
Max
Notes
A
0.900
1.450
0.035
0.057
-
A1
0.000
0.150
0.000
0.006
-
A2
0.900
1.300
0.035
0.051
-
b
0.350
0.500
0.0138
0.0196
-
C
0.080
0.220
0.0031
0.009
-
D
2.800
3.000
0.11
0.118
3
E
2.600
3.000
0.102
0.118
-
E1
1.500
1.750
0.06
0.069
3
e
0.95 Ref
0.0374 Ref
-
e1
1.9 Ref
0.0748 Ref
-
L
0.100
0.600
0.004
0.023
4,5
N
6
6
6
a
0º
10º
0º
10º
-
M
2.590
0.102
-
O
0.690
.027 TYP
-
P
0.990
.039 TYP
-
R
0.950
0.038
-
Notes:
1. Dimensioning and tolerances per ANSI 14.5M-1982.
2. Package conforms to EIAJ SC-74 (1992).
3. Dimensions D and E1 are exclusive of mold flash, protrusions, or gate burrs.
4. Footlenth L measured at reference to seating plane.
5. “L” is the length of flat foot surface for soldering to substrate.
6. “N” is the number of terminal positions.
7. Controling dimension: MILLIMETER. Converted inch dimensions are not necessarily
exact.
©2009 Littelfuse, Inc.
47
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
SP3002 Lead-Free/Green Series